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| 型号： | ICS853S012AKI |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 853S SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC32 |
| 封装： | 5 MM X 5 MM, 0.75 MM HEIGHT, MO-220VHHD-2, VFQFN-32 |
| 文件页数： | 2/17页 |
| 文件大小： | 2291K |
| 代理商： | ICS853S012AKI |
IDT / ICS LVPECL CLOCK/DATA MULTIPLEXER
10
ICS853S012AKI REV. A JANUARY 4, 2007
ICS853S012I
12:1, DIFFERENTIAL-TO-3.3V, 2.5V LVPECL CLOCK/DATA MULTIPLEXER
PRELIMINARY
V
CC - 2V
50
50
RTT
Z
o = 50
Z
o = 50
FOUT
FIN
RTT =
Z
o
1
((V
OH + VOL) / (VCC – 2)) – 2
3.3V
125
125
84
84
Z
o = 50
Z
o = 50
FOUT
FIN
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are rec-
ommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminat-
ing resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
50
transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion.
Figures 4A and 4B show two different layouts which
are recommended only as guidelines. Other suitable clock lay-
outs may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
FIGURE 4B. LVPECL OUTPUT TERMINATION
FIGURE 4A. LVPECL OUTPUT TERMINATION
TERMINATION FOR 3.3V LVPECL OUTPUTS
EXPOSED PAD
Expose Metal Pad
(GROUND PAD)
GROUND PLANE
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
THERMAL VIA
SOLDER MASK
FIGURE 3. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
solder as shown in
Figure 3 For further information, please refer
to the Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS853S012AKILF | 功能描述:IC CLOCK/DATA MUX 12:1 32-VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS853S013AMILF | 功能描述:IC CLOCK BUFFER 1:3 2GHZ 20-SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS853S014AGILF | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP |
| ICS853S014AGILFT | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFF 2:5 2GHZ 20TSSOP |
| ICS853S01AGILF | 制造商:Integrated Device Technology Inc 功能描述: |
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