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| 型号： | ICS853S012AKI |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 853S SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC32 |
| 封装： | 5 MM X 5 MM, 0.75 MM HEIGHT, MO-220VHHD-2, VFQFN-32 |
| 文件页数： | 4/17页 |
| 文件大小： | 2291K |
| 代理商： | ICS853S012AKI |
IDT / ICS LVPECL CLOCK/DATA MULTIPLEXER
12
ICS853S012AKI REV. A JANUARY 4, 2007
ICS853S012I
12:1, DIFFERENTIAL-TO-3.3V, 2.5V LVPECL CLOCK/DATA MULTIPLEXER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS83S012I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS83S012I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 70mA = 242.6mW
Power (outputs)
MAX
= 30.94mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) = 242.6mW + 30.94mW = 273.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no
air flow and a multi-layer board, the appropriate value is 34.8°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.274W * 34.8°C/W = 94.5°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA
vs. Air Flow (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
34.8°C/W
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
32 LEAD VFQFN, FORCED CONVECTION
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS853S012AKILF | 功能描述:IC CLOCK/DATA MUX 12:1 32-VFQFN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:HiPerClockS™ 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS853S013AMILF | 功能描述:IC CLOCK BUFFER 1:3 2GHZ 20-SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| ICS853S014AGILF | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP |
| ICS853S014AGILFT | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER 20TSSOP 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFF 2:5 2GHZ 20TSSOP |
| ICS853S01AGILF | 制造商:Integrated Device Technology Inc 功能描述: |
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