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| 型号： | ICS8745BM-21LF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 7/19页 |
| 文件大小： | 0K |
| 描述： | IC CLK GEN ZD DIFF-LVDS 20-SOIC |
| 标准包装： | 37 |
| 系列： | HiPerClockS™ |
| 类型： | 时钟发生器 |
| PLL： | 带旁路 |
| 输入： | HCSL，LVDS，LVHSTL，LVPECL，SSTL |
| 输出： | LVDS |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:1 |
| 差分 - 输入:输出： | 是/是 |
| 频率 - 最大： | 700MHz |
| 除法器/乘法器： | 是/是 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 20-SOIC |
| 包装： | 管件 |
| 其它名称： | 800-1218 800-1218-5 800-1218-ND 8745BM-21LF |
ICS8745BM-21 REVISION D JANUARY 25, 2010
15
2010 Integrated Device Technology, Inc.
ICS8745B-21 Data Sheet
1:1 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8745B-21.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8745B-21 is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (125mA + 17mA) = 492mW
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 59mA = 204mW
Total Power_MAX = 492mW + 204mW = 696mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate air
flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 39.7°C/W per Table 7below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.696W * 39.7°C/W = 97.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance θJA for 20 Lead SOIC, Forced Convection
θ
JA vs. Air Flow
Linear Feet per Minute
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
65.7°C/W
57.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
46.2°C/W
39.7°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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