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| 型号： | ICS874S02BMILF |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 874S SERIES, PLL BASED CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
| 封装： | 7.50 X 12.80 MM, 2.30 MM HEIGHT, ROHS COMPLIANT, MS-013, MO-119, SOIC-20 |
| 文件页数： | 4/15页 |
| 文件大小： | 786K |
| 代理商： | ICS874S02BMILF |
874S02BMI
12
REV. A JANUARY 21, 2008
ICS874S02I
1:1 DIFFERENTIAL-TO-LVDS
ZERO DELAY CLOCK GENERATOR
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS874S02I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS874S02I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD = 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (84mA + 18mA) = 353.43mW
Power (outputs)
MAX = VDDO_MAX * IDDO_MAX = 3.465V * 30mA = 103.95mW
Total Power
_MAX = 353.43mW + 103.95mW = 457.38mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
q
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 39.7°C/W per
Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.457W * 39.7°C/W = 103.1°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-LEAD SOIC, FORCED CONVECTION
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
65.7°C/W
57.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
46.2°C/W
39.7°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS874S02BMILFT | 功能描述:IC CLK GEN 1:1 DIFF ZD 20SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:1,000 系列:- 类型:时钟/频率合成器，扇出分配 PLL:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 除法器/乘法器:- 电源电压:- 工作温度:- 安装类型:表面贴装 封装/外壳:56-VFQFN 裸露焊盘 供应商设备封装:56-VFQFP-EP（8x8） 包装:带卷 (TR) 其它名称:844S012AKI-01LFT |
| ICS874S02BMIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK GENERATOR ZDB 20SOIC |
| ICS874S336AGLF | 功能描述:IC CLOCK MULTIPLIER LVDS 20TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ICS874S336AGLFT | 功能描述:IC CLOCK MULTIPLIER LVDS 20TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ICS8752CY | 制造商:INT_CIR_SYS 功能描述: |
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