参数资料
型号: IDT7026S25J8
厂商: IDT, Integrated Device Technology Inc
文件页数: 10/18页
文件大小: 0K
描述: IC SRAM 256KBIT 25NS 84PLCC
标准包装: 200
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 256K(16K x 16)
速度: 25ns
接口: 并联
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
封装/外壳: 84-LCC(J 形引线)
供应商设备封装: 84-PLCC(29.21x29.21)
包装: 带卷 (TR)
其它名称: 7026S25J8
IDT7026S/L
High-Speed 16K x 16 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, R/ W Controlled Timing (1,5,8)
t WC
ADDRESS
t HZ (7)
OE
t AW
CE or SEM
UB or LB
(9)
(9)
t AS (6)
t WP (2)
t WR
(3)
R/ W
t WZ (7)
t OW
DATA OUT
(4)
t DW
t DH
(4)
CE or SEM
DATA IN
2939 drw 08
Timing Waveform of Write Cycle No. 2, CE , UB , LB Controlled Timing (1,5)
t WC
ADDRESS
t AW
(9)
UB or LB
(9)
R/ W
t AS (6)
t EW (2)
t DW
t WR (3)
t DH
DATA IN
2939 drw 09
NOTES:
1. R/ W or CE or UB and LB = V IH during all address transitions.
2. A write occurs during the overlap (t EW or t WP ) of a V IL CE = V IL and R/ W = V IL for memory array writing cycle.
3. t WR is measured from the earlier of CE or R/ W (or SEM or R/ W ) going V IH to the end of write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the CE or SEM = V IL transition occurs simultaneously with or after the R/ W = V IL transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last, CE or R/ W .
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure
2).
8. If OE = V IL during R/ W controlled write cycle, the write pulse width must be the larger of t WP or (t WZ + t DW ) to allow the I/O drivers to turn off and data to be placed
on the bus for the required t DW . If OE = V IH during an R/ W controlled write cycle, this requirement does not apply and the write pulse can be as short as the
specified t WP .
9. To access RAM, CE = V IL and SEM = V IH . To access semaphore, CE = V IH and SEM = V IL . t EW must be met for either condition.
10
6.42
相关PDF资料
PDF描述
IDT7026S20J8 IC SRAM 256KBIT 20NS 84PLCC
IDT70V35L25PF IC SRAM 144KBIT 25NS 100TQFP
IDT70V35L20PF IC SRAM 144KBIT 20NS 100TQFP
IDT70V06L35J IC SRAM 128KBIT 35NS 68PLCC
IDT70V06L25J IC SRAM 128KBIT 25NS 68PLCC
相关代理商/技术参数
参数描述
IDT7026S35G 功能描述:IC SRAM 256KBIT 35NS 84PGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
IDT7026S35J 功能描述:IC SRAM 256KBIT 35NS 84PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT7026S35J8 功能描述:IC SRAM 256KBIT 35NS 84PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT7026S55J 功能描述:IC SRAM 256KBIT 55NS 84PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT7026S55J8 功能描述:IC SRAM 256KBIT 55NS 84PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:45 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,异步 存储容量:128K(8K x 16) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:70V25S15PF