参数资料
型号: IDT7054L25GB
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: SRAM
英文描述: HIGH-SPEED 4K x 8 FourPort STATIC RAM
中文描述: 4K X 8 FOUR-PORT SRAM, 25 ns, CPGA108
封装: CERAMIC, PGA-108
文件页数: 11/11页
文件大小: 99K
代理商: IDT7054L25GB
6.42
IDT7054S/L
High-Speed 4K x 8 FourPort Static RAM
Military, Industrial and Commercial Temperature Ranges
9
CE
3241 drw 08
tAW
tAS
tWR
tDW
DATAIN
ADDRESS
tWC
R/
W
tEW
tDH
(6)
(2)
(3)
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(5,8)
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5)
NOTES:
1. R/
W or CE = VIH during all address transitions.
2. A write occurs during the overlap (tEW or tWP) of a
CE = VIL and a R/W = VIL.
3. tWR is measured from the earlier of
CE or R/W = VIH to the end of write cycle.
4. During this period, the I/O pins are in the output state, and input signals must not be applied.
5. If the
CE LOW transition occurs simultaneously with or after the R/W = VIL transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last,
CE or R/W.
7. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed but is not production tested.
8. If
OE = VIL during a R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off data to be placed
on the bus for the required tDW. If
OE = VIH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the
specified tWP.
CE
3241 drw 07
tAW
tAS
tWR
tDW
DATAIN
ADDRESS
tWC
R/
W
tWP
DATAOUT
tWZ
(7)
(4)
(2)
tOW
OE
(7)
tHZ
tLZ
(7)
tHZ
(6)
(3)
tDH
相关PDF资料
PDF描述
IDT7054L25GI HIGH-SPEED 4K x 8 FourPort STATIC RAM
IDT7054L25PRF HIGH-SPEED 4K x 8 FourPort STATIC RAM
IDT7054L25PRFB HIGH-SPEED 4K x 8 FourPort STATIC RAM
IDT7054L25PRFI HIGH-SPEED 4K x 8 FourPort STATIC RAM
IDT7054L35G HIGH-SPEED 4K x 8 FourPort STATIC RAM
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参数描述
IDT7054L25PRF 功能描述:IC SRAM 32KBIT 25NS 128TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT7054L25PRF8 功能描述:IC SRAM 32KBIT 25NS 128TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
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IDT7054L25PRFI8 功能描述:IC SRAM 32KBIT 25NS 128TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
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