参数资料
型号: IDT70T3519S133BFGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 19/28页
文件大小: 0K
描述: IC SRAM 9MBIT 133MHZ 208FBGA
标准包装: 7
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,同步
存储容量: 9M(256K x 36)
速度: 133MHz
接口: 并联
电源电压: 2.4 V ~ 2.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 208-LFBGA
供应商设备封装: 208-CABGA(15x15)
包装: 托盘
产品目录页面: 1254 (CN2011-ZH PDF)
其它名称: 70T3519S133BFGI
800-1380
IDT70T3519/99/89S
High-Speed 2.5V 256/128/64K x 36 Dual-Port Synchronous Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Write with Address Counter Advance
(Flow-through or Pipelined Inputs) (1)
t CYC2
CLK
t CH2
t CL2
t SA
t HA
ADDRESS
An
INTERNAL (3)
ADDRESS
An (7)
An + 1
An + 2
An + 3
An + 4
t SAD t HAD
ADS
t SCN t HCN
CNTEN
t SD t HD
DATA IN
Dn
Dn + 1
Dn + 1
Dn + 2
Dn + 3
Dn + 4
WRITE
EXTERNAL
ADDRESS
WRITE WRITE
WITH COUNTER COUNTER HOLD
WRITE WITH COUNTER
5666 drw 17
Timing Waveform of Counter Repeat
t CYC2
CLK
t SA t HA
(2,6)
ADDRESS
An
INTERNAL
ADDRESS
(3)
An
An+1
An+2
An+2
An
An+1
An+2
An+2
t SAD t HAD
ADS
t SW t HW
R/ W
t SCN t HCN
CNTEN
REPEAT
(4)
t SRPT t HRPT
t SD t HD
DATA IN
D 0
D 1
D 2
D 3
t CD1
DATA OUT
An
An+1
An+2
An+2
,
WRITE TO ADVANCE
ADS COUNTER
ADDRESS WRITE TO
An An+1
NOTES:
1. CE 0 , BE n , and R/ W = V IL ; CE 1 and REPEAT = V IH .
ADVANCE
COUNTER
WRITE TO
An+2
HOLD
COUNTER
WRITE TO
An+2
REPEAT
READ LAST
ADS
ADDRESS
An
ADVANCE
COUNTER
READ
An+1
ADVANCE
COUNTER
READ
An+2
HOLD
COUNTER
READ
An+2
5666 drw 18
2. CE 0 , BE n = V IL ; CE 1 = V IH .
3. The "Internal Address" is equal to the "External Address" when ADS = V IL and equals the counter output when ADS = V IH .
4. No dead cycle exists during REPEAT operation. A READ or WRITE cycle may be coincidental with the counter REPEAT cycle: Address loaded by last valid
ADS load will be accessed. For more information on REPEAT function refer to Truth Table II.
5. CNTEN = V IL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’Address is
written to during this cycle.
6. For Pipelined Mode user should add 1 cycle latency for outputs as per timing waveform of read cycle for pipelined operations.
19
6.42
相关PDF资料
PDF描述
IDT70T651S12DR IC SRAM 9MBIT 12NS 208QFP
MC8641VU1000NB IC MPU SGL E600 CORE 994FCCBGA
IDT70T651S12BCI IC SRAM 9MBIT 12NS 256BGA
IDT70T633S12BCI IC SRAM 9MBIT 12NS 256BGA
MC8641VU1000GC IC MPU SGL E600 CORE 994FCCBGA
相关代理商/技术参数
参数描述
IDT70T3519S133BFGI8 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 9MBIT 133MHZ 208CABGA
IDT70T3519S133BFI 功能描述:IC SRAM 9MBIT 133MHZ 208FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
IDT70T3519S133BFI8 功能描述:IC SRAM 9MBIT 133MHZ 208FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
IDT70T3519S133DR 功能描述:IC SRAM 9MBIT 133MHZ 208QFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
IDT70T3519S133DRI 功能描述:IC SRAM 9MBIT 133MHZ 208QFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)