参数资料
型号: IDT70V18L20PFI
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/17页
文件大小: 0K
描述: IC SRAM 576KBIT 20NS 100TQFP
标准包装: 6
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 576K(64K x 9)
速度: 20ns
接口: 并联
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 托盘
其它名称: 70V18L20PFI
IDT70V18L
High-Speed 3.3V 64K x 9 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, R/ W Controlled Timing (1,5,8)
t WC
ADDRESS
t HZ (7)
OE
t AW
CE or SEM
(9)
t HZ (7)
R/ W
DATA OUT
t AS (6)
t LZ
t WZ (7)
(4)
t WP (2)
t OW
t WR (3)
(4)
DATA IN
t DW
t DH
,
CE or SEM
4854 drw 07
Timing Waveform of Write Cycle No. 2, CE Controlled Timing (1,5)
t WC
ADDRESS
t AW
(9,10)
t AS
(6)
t EW (2)
t WR
(3)
R/ W
t DW
t DH
DATA IN
4854 drw 08
NOTES:
1. R/ W or CE = V IH during all address transitions.
2. A write occurs during the overlap (t EW or t WP ) of a CE = V IL and a R/ W = V IL for memory array writing cycle.
3. t WR is measured from the earlier of CE or R/ W (or SEM or R/ W ) going HIGH to the end of write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the CE or SEM = V IL transition occurs simultaneously with or after the R/ W = V IL transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last, CE or R/ W .
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load
(Figure 2).
8. If OE = V IL during R/ W controlled write cycle, the write pulse width must be the larger of t WP or (t WZ + t DW ) to allow the I/O drivers to turn off and data to be placed on the bus
for the required t DW . If OE = V IH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified t WP .
9. To access RAM, CE = V IL and SEM = V IH . To access semaphore, CE = V IH and SEM = V IL . t EW must be met for either condition.
10. Refer to Truth Table I - Chip Enable .
8
相关PDF资料
PDF描述
IDT70V25L55G IC SRAM 128KBIT 55NS 84PGA
IDT70V261L25PFGI IC SRAM 256KBIT 25NS 100TQFP
IDT70V26L35G IC SRAM 256KBIT 35NS 84PGA
IDT70V27S15PF IC SRAM 512KBIT 15NS 100TQFP
IDT70V28L20PFGI IC SRAM 1MBIT 20NS 100TQFP
相关代理商/技术参数
参数描述
IDT70V18L20PFI8 功能描述:IC SRAM 576KBIT 20NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT70V19L15PF 功能描述:IC SRAM 1.125MBIT 15NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
IDT70V19L15PF8 功能描述:IC SRAM 1.125MBIT 15NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT70V19L20PF 功能描述:IC SRAM 1.125MBIT 20NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT70V19L20PF8 功能描述:IC SRAM 1.125MBIT 20NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8