参数资料
型号: IDT70V261L25PFG
厂商: IDT, Integrated Device Technology Inc
文件页数: 2/17页
文件大小: 0K
描述: IC SRAM 256KBIT 25NS 100TQFP
标准包装: 45
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 256K(16K x 16)
速度: 25ns
接口: 并联
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 托盘
产品目录页面: 1254 (CN2011-ZH PDF)
其它名称: 70V261L25PFG
800-1390
IDT70V261S/L
High-Speed 16K x 16 Dual-Port Static RAM with Interrupt
Description
The IDT70V261 is a high-speed 16K x 16 Dual-Port Static RAM. The
IDT70V261 is designed to be used as a stand-alone 256K-bit Dual-Port
RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit-or-
more word systems. Using the IDT MASTER/SLAVE Dual-Port RAM
approach in 32-bit or wider memory system applications results in full-
speed, error-free operation without the need for additional discrete logic.
This device provides two independent ports with separate control,
Pin Configurations (1,2,3)
12/11/01
Index
Industrial and Commercial Temperature Ranges
address, and I/O pins that permit independent, asynchronous access for
reads or writes to any location in memory. An automatic power down
feature controlled by CE permits the on-chip circuitry of each port to enter
a very low standby power mode.
Fabricated using CMOS high-performance technology, these de-
vices typically operate on only 300mW of power.
The IDT70V261 is packaged in a 100-pin Thin Quad Flatpack.
N/C
N/C
N/C
N/C
I/O 10L
I/O 11L
I/O 12L
I/O 13L
GND
1
2
3
4
5
6
7
8
9
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
75
74
73
72
71
70
69
68
67
N/C
N/C
N/C
A 6L
A 5L
A 4L
A 3L
A 2L
A 1L
I/O 14L
I/O 15L
V CC
GND
I/O 0R
I/O 1R
I/O 2R
V CC
I/O 3R
I/O 4R
I/O 5R
I/O 6R
N/C
N/C
N/C
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IDT70V261PF
PN100-1 (4)
100-Pin TQFP
Top View (5)
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
A 0L
INT L
BUSY L
GND
M/S
BUSY R
INT R
A 0R
A 1R
A 2R
A 3R
A 4R
A 5R
N/C
N/C
25
N/C
51
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
N/C
,
3040 drw 02
NOTES:
1. All V CC pins must be connected to power supply.
Pin Names
2. All GND pins must be connected to ground supply.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
Left Port
CE L
R/ W L
OE L
A 0L - A 13L
I/O 0L - I/O 15L
SEM L
UB L
LB L
BUSY L
Right Port
CE R
R/ W R
OE R
A 0R - A 13R
I/O 0R - I/O 15R
SEM R
UB R
LB R
BUSY R
M/ S
V CC
GND
Names
Chip Enable
Read/Write Enable
Output Enable
Address
Data Input/Output
Semaphore Enable
Upper Byte Select
Lower Byte Select
Busy Flag
Master or Slave Select
Power
Ground
3040 tbl 01
6.42
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