参数资料
型号: IDT7164L25YG8
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/10页
文件大小: 0K
描述: IC SRAM 64KBIT 25NS 28SOJ
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 异步
存储容量: 64K (8K x 8)
速度: 25ns
接口: 并联
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
封装/外壳: 28-BSOJ
供应商设备封装: 28-SOJ
包装: 带卷 (TR)
其它名称: 7164L25YG8
IDT7164S/L
CMOS Static RAM 64K (8K x 8-Bit)
Military, Commercial, and Industrial Temperature Ranges
Timing Waveform of Write Cycle No. 1 ( WE Controlled Timing) (1,5)
t WC
ADDRESS
CS 2
CS 1
WE
t AS
t AW
t WR1(2)
DATA OUT
DATA IN
(3)
t WHZ (6)
t WP (5)
t DW
DATA VALID
t OW(6)
t DH1,2
2967 drw 08
Timing Waveform of Write Cycle No. 2 ( CS Controlled Timing) (1)
t WC
ADDRESS
CS 2
t AS
t CW
t WR2(2)
t WR1(2)
CS 1
(4)
t AW
WE
t DW
t DH1,2
DATA IN
DATA VALID
2967 drw 09
NOTES:
1. A write occurs during the overlap of a LOW WE , a LOW CS 1 and a HIGH CS 2 .
2. t WR1, 2 is measured from the earlier of CS 1 or WE going HIGH or CS 2 going LOW to the end of the write cycle.
3. During this period, I/O pins are in the output state so that the input signals must not be applied.
4. If the CS 1 LOW transition or CS 2 HIGH transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.
5. OE is continuously HIGH. If OE is LOW during a WE controlled write cycle, the write pulse width must be the larger of t WP or (t WHZ +t DW ) to allow the I/O drivers to
turn off and data to be placed on the bus for the required t DW . If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum
write pulse width is as short as the specified t WP .
6. Transition is measured ±200mV from steady state.
8
相关PDF资料
PDF描述
FMM25DSEN CONN EDGECARD 50POS .156 EYELET
FMM25DSEH CONN EDGECARD 50POS .156 EYELET
FMM25DRKN CONN EDGECARD 50POS DIP .156 SLD
IDT71V3559S75PFG8 IC SRAM 4MBIT 75NS 100TQFP
IDT71V016SA20PHGI IC SRAM 1MBIT 20NS 44TSOP
相关代理商/技术参数
参数描述
IDT7164L25YGI 功能描述:IC SRAM 64KBIT 25NS 28SOJ RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
IDT7164L25YGI8 功能描述:IC SRAM 64KBIT 25NS 28SOJ RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
IDT7164L25YI 功能描述:IC SRAM 64KBIT 25NS 28SOJ RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ
IDT7164L25YI8 功能描述:IC SRAM 64KBIT 25NS 28SOJ RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ
IDT7164L35DB 制造商:Integrated Device Technology Inc 功能描述: 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 64KBIT 35NS 28CDIP