参数资料
型号: IDT71T75902S85BG8
厂商: IDT, Integrated Device Technology Inc
文件页数: 13/26页
文件大小: 0K
描述: IC SRAM 18MBIT 85NS 119BGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步 ZBT
存储容量: 18M(1M x 18)
速度: 85ns
接口: 并联
电源电压: 2.375 V ~ 2.625 V
工作温度: 0°C ~ 70°C
封装/外壳: 119-BGA
供应商设备封装: 119-PBGA(14x22)
包装: 带卷 (TR)
其它名称: 71T75902S85BG8
IDT71T75702, IDT71T75902, 512K x 36, 1M x 18, 2.5V Synchronous ZBT? SRAMs with
2.5V I/O, Burst Counter and Flow-Through Outputs Commercial and Industrial Temperature Ranges
Read Operation with Chip Enable Used (1)
Cycle
n
n+1
n+2
n+3
n+4
n+5
n+6
n+7
n+8
n+9
Address
X
X
A 0
X
A 1
X
X
A 2
X
X
R/ W
X
X
H
X
H
X
X
H
X
X
ADV/ LD
L
L
L
L
L
L
L
L
L
L
CE 1 (2)
H
H
L
H
L
H
H
L
H
H
CEN
L
L
L
L
L
L
L
L
L
L
BW x
X
X
X
X
X
X
X
X
X
X
OE
X
X
X
L
X
L
X
X
L
X
I/O (3)
?
Z
Z
Q 0
Z
Q 1
Z
Z
Q 2
Z
Comments
Deselected.
Deselected.
Address A 0 and Control meet setup.
Address A 0 read out, Deselected.
Address A 1 and Control meet setup.
Address A 1 read out, Deselected.
Deselected.
Address A 2 and Control meet setup.
Address A 2 read out, Deselected.
Deselected.
NOTES:
1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance.
2. CE 2 timing transition is identical to CE 1 signal. CE 2 timing transition is identical but inverted to the CE 1 and CE 2 signals.
3. Device outputs are ensured to be in High-Z during device power-up.
Write Operation with Chip Enable Used (1)
5319 tbl 19
Cycle
n
n+1
n+2
n+3
n+4
n+5
n+6
n+7
n+8
n+9
Address
X
X
A 0
X
A 1
X
X
A 2
X
X
R/ W
X
X
L
X
L
X
X
L
X
X
ADV/ LD
L
L
L
L
L
L
L
L
L
L
CE (2)
H
H
L
H
L
H
H
L
H
H
CEN
L
L
L
L
L
L
L
L
L
L
BW x
X
X
L
X
L
X
X
L
X
X
OE
X
X
X
X
X
X
X
X
X
X
I/O
?
Z
Z
D 0
Z
D 1
Z
Z
D 2
Z
Comments
Deselected.
Deselected.
Address A 0 and Control meet setup
Data D 0 Write In, Deselected.
Address A 1 and Control meet setup
Data D 1 Write In, Deselected.
Deselected.
Address A 2 and Control meet setup
Data D 2 Write In, Deselected.
Deselected.
NOTES:
1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance.
2. CE = L is defined as CE 1 = L, CE 2 = L and CE2 = H. CE = H is defined as CE 1 = H, CE 2 = H or CE 2 = L.
13
6.42
5319 tbl 20
相关PDF资料
PDF描述
AMC49DRYI-S93 CONN EDGECARD 98POS DIP .100 SLD
AMC50DRYH-S93 CONN EDGECARD 100PS DIP .100 SLD
IDT71T75802S150BGG8 IC SRAM 18MBIT 150MHZ 119BGA
65801-048LF CLINCHER RECEPTACLE ASSY GOLD
65801-146LF CLINCHER RECEPTACLE ASSY GOLD
相关代理商/技术参数
参数描述
IDT71T75902S85BGG 功能描述:IC SRAM 18MBIT 85NS 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,同步 存储容量:1.125M(32K x 36) 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA(17x17) 包装:带卷 (TR) 其它名称:70V3579S5BCI8
IDT71T75902S85BGG8 功能描述:IC SRAM 18MBIT 85NS 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:45 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,异步 存储容量:128K(8K x 16) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:70V25S15PF
IDT71T75902S85BGGI 功能描述:IC SRAM 18MBIT 85NS 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI
IDT71T75902S85BGGI8 功能描述:IC SRAM 18MBIT 85NS 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI
IDT71T75902S85BGI 功能描述:IC SRAM 18MBIT 85NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 05/Nov/2008 标准包装:84 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 ZBT 存储容量:4.5M(128K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:119-BGA 供应商设备封装:119-PBGA(14x22) 包装:托盘 其它名称:71V3557SA75BGI