参数资料
型号: IDT71V35761SA183BG8
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/21页
文件大小: 0K
描述: IC SRAM 4MBIT 183MHZ 119BGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 同步
存储容量: 4.5M(128K x 36)
速度: 183MHz
接口: 并联
电源电压: 3.135 V ~ 3.465 V
工作温度: 0°C ~ 70°C
封装/外壳: 119-BGA
供应商设备封装: 119-PBGA(14x22)
包装: 带卷 (TR)
其它名称: 71V35761SA183BG8
IDT71V35761, 128K x 36, 3.3V Synchronous SRAMs with
3.3V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
Commercial and Industrial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (V DD = 3.3V ± 5%)
Symbol
|I LI |
|I LZZ |
|I LO |
V OL
V OH
Parameter
Input Leakage Current
ZZ, LBO and JTAG Input Leakage Current (1)
Output Leakage Current
Output Low Voltage
Output High Voltage
Test Conditions
V DD = Max., V IN = 0V to V DD
V DD = Max., V IN = 0V to V DD
V OUT = 0V to V DDQ , Device Deselected
I OL = +8mA, V DD = Min.
I OH = -8mA, V DD = Min.
Min.
___
___
___
___
2.4
Max.
5
30
5
0.4
___
Unit
μA
μA
μA
V
V
NOTE:
5301 tbl 08
1. The LBO, TMS, TDI, TCK & TRST pins will be internally pulled to V DD and the ZZ pin will be internally pulled to V SS if they are not actively driven in the application.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (1)
200MHz
183MHz
166 MHz
Symbol
I DD
Parameter
Operating Power Supply
Test Conditions
Device Selecte d, Outputs Open, V DD = Max.,
Com'l
360
Com'l
340
Ind
350
Com'l
320
Ind
330
Unit
mA
Current
V DDQ = Max., V IN > V IH or < V IL , f = f MAX (2)
I SB1
CMOS Standby Power
Device Deselected, Outputs Open, V DD = Max.,
30
30
35
30
35
mA
Supply Current
V DDQ = Max., V IN > V HD or < V LD , f = 0 (2,3)
I SB2
Clock Running Power
Device Deselected, Outputs Open, V DD = Max.,
130
120
130
110
120
mA
Supply Current
V DDQ = Max., V IN > V HD or < V LD , f = f MAX (2,3)
I ZZ
Full Sleep Mode Supply
ZZ > V HD, V DD = Max.
30
30
35
30
35
mA
Current
5301 tbl 09
NOTES:
1. All values are maximum guaranteed values.
2. At f = f MAX, inputs are cycling at the maximum frequency of read cycles of 1/t CYC while ADSC = LOW; f=0 means no input lines are changing.
3. For I/Os V HD = V DDQ - 0.2V, V LD = 0.2V. For other inputs V HD = V DD - 0.2V, V LD = 0.2V.
AC Test Conditions
(V DDQ = 3.3V)
Input Pulse Levels
0 to 3V
AC Test Load
V DDQ /2
50 Ω
Input Rise/Fall Times
2ns
I/O
Z 0 = 50 Ω
5301 drw 06
,
Δ tCD
Input Timing Reference Levels
Output Timing Reference Levels
AC Test Load
1.5V
1.5V
See Figure 1
5301 tbl 10
6
5
4
3
(Typical, ns)
2
1
Figure 1. AC Test Load
20 30 50
80 100
Capacitance (pF)
200
5301 drw 07
,
Figure 2. Lumped Capacitive Load, Typical Derating
8
6.42
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IDT71V35761SA183BGG8 功能描述:IC SRAM 4MBIT 183MHZ 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V35761SA183BGGI 功能描述:IC SRAM 4MBIT 183MHZ 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
IDT71V35761SA183BGGI8 功能描述:IC SRAM 4MBIT 183MHZ 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA(6x8) 包装:带卷 (TR)
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