参数资料
型号: IDT72V275L15PFI
厂商: IDT, Integrated Device Technology Inc
文件页数: 8/25页
文件大小: 0K
描述: IC FIFO SS 32768X18 15NS 64-TQFP
标准包装: 90
系列: 72V
功能: 同步
存储容量: 589K(32K x 18)
访问时间: 15ns
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-LQFP
供应商设备封装: 64-TQFP(14x14)
包装: 托盘
其它名称: 72V275L15PFI
16
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V275/72V285 3.3V CMOS SUPERSYNC FIFOTM
32,768 x 18 and 65,536 x 18
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing (IDT Standard Mode)
NOTES:
1. tSKEW3 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that
EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge
of WCLK and the rising edge of RCLK is less than tSKEW3, then
EF deassertion may be delayed one extra RCLK cycle.
2.
LD = HIGH.
3. First word latency: 60ns + tREF + 1*TRCLK.
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that
FF will go high (after one WCLK cycle pus tWFF). If the time between the rising
edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the
FF deassertion may be delayed one extra WCLK cycle.
2.
LD = HIGH, OE = LOW, EF = HIGH.
Figure 7. Write Cycle and Full Flag Timing (IDT Standard Mode)
NO OPERATION
RCLK
REN
4512 drw 11
EF
tCLK
tCLKH
tCLKL
tENH
tREF
tA
tOLZ
tOE
Q0 - Qn
OE
WCLK
(1)
tSKEW3
WEN
D0 - Dn
tENS
tENH
tDS
tDHS
D0
1
2
tOLZ
NO OPERATION
LAST WORD
D0
D1
tENS
tENH
tDS
tDH
tOHZ
LAST WORD
tREF
tENH
tENS
tA
tREF
tENS
tENH
D0 - Dn
WEN
RCLK
REN
tENH
Q0 - Qn
DATA READ
NEXT DATA READ
DATA IN OUTPUT REGISTER
tSKEW1
(1)
4512 drw 10
WCLK
NO WRITE
1
2
1
2
tDS
NO WRITE
tWFF
tA
tENS
tSKEW1
(1)
tDS
tA
D X
tDH
tCLK
tCLKH
tCLKL
DX+1
tWFF
tDH
FF
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IDT72V275L15TF8 功能描述:IC FIFO SS 32768X18 15NS 64STQFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:15 系列:74F 功能:异步 存储容量:256(64 x 4) 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP(0.300",7.62mm) 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433
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