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参数资料
| 型号： | IDT72V283L10PFI8 |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 35/45页 |
| 文件大小： | 0K |
| 描述： | IC FIFO 32768X18 10NS 80QFP |
| 标准包装： | 750 |
| 系列： | 72V |
| 功能： | 异步，同步 |
| 存储容量： | 589K（32K x 18） |
| 数据速率： | 100MHz |
| 访问时间： | 10ns |
| 电源电压： | 3.15 V ~ 3.45 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 80-LQFP |
| 供应商设备封装： | 80-TQFP（14x14） |
| 包装： | 带卷 (TR) |
| 其它名称： | 72V283L10PFI8 |
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40
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V223/233/243/253/263/273/283/293 3.3V HIGH DENSITY SUPERSYNC IITM NARROW BUS FIFO
512 x 18, 1K x 9/18, 2K x 9/18, 4K x 9/18, 8K x 9/18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9
FEBRUARY 11, 2009
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72V223 can easily be adapted to applications requiring depths
greaterthan512whenthex18Inputorx18OutputbusWidthisselected,1,024
for the IDT72V233, 2,048 for the IDT72V243, 4,096 for the IDT72V253, 8,192
for the IDT72V263, 16,384 for the IDT72V273, 32,768 for the IDT72V283 and
65,536 for the IDT72V293. When both x9 Input and x9 Output bus Widths are
selected, depths greater than 1,024 can be adapted for the IDT72V223, 2,048
fortheIDT72V233,4,096fortheIDT72V243,8,192fortheIDT72V253,16,384
for the IDT72V263, 32,768 for the IDT72V273, 65,536 for the IDT72V283 and
131,072 for the IDT72V293. In FWFT mode, the FIFOs can be connected in
series (the data outputs of one FIFO connected to the data inputs of the next)
with no external logic necessary. The resulting configuration provides a total
depth equivalent to the sum of the depths associated with each single FIFO.
Figure 30 shows a depth expansion using two IDT72V223/72V233/72V243/
72V253/72V263/72V273/72V283/72V293 devices.
CareshouldbetakentoselectFWFTmodeduringMasterResetforallFIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain–no read operation is
necessarybuttheRCLKofeachFIFOmustbefree-running.Eachtimethedata
word appears at the outputs of one FIFO, that device's
OR line goes LOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for
ORof
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
whereNisthenumberofFIFOsintheexpansionandTRCLKistheRCLKperiod.
Note that extra cycles should be added for the possibility that the tSKEW1
specificationisnotmetbetweenWCLKandtransferclock,orRCLKandtransfer
clock, for the
OR flag.
The"rippledown"delayisonlynoticeableforthefirstwordwrittentoanempty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it
finally moves into the first FIFO of the chain. Each time a free location is
created in one FIFO of the chain, that FIFO's
IR line goes LOW, enabling the
preceding FIFO to write a word to fill it.
Forafullexpansionconfiguration,theamountoftimeittakesfor
IRofthefirst
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period.NotethatextracyclesshouldbeaddedforthepossibilitythatthetSKEW1
specificationisnotmetbetweenRCLKandtransferclock,orWCLKandtransfer
clock, for the
IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
Figure 30. Block Diagram of Depth Expansion
For the x18 Input or x18 Output bus Width: 1,024 x 18, 2,048 x 18, 4,096 x 18, 8,192 x 18, 16,384 x 18, 32,768 x 18, 65,536 x 18 and 131,072 x 18
For both x9 Input and x9 Output bus Widths: 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9, 65,536 x 9, 131,072 x 9 and 262,144 x 9
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
4666 drw33
n
FWFT/SI
IDT
72V223
72V233
72V243
72V253
72V263
72V273
72V283
72V293
IDT
72V223
72V233
72V243
72V253
72V263
72V273
72V283
72V293
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT72V283L15PF | 功能描述:IC FIFO 32768X18 15NS 80QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
| IDT72V283L15PF8 | 功能描述:IC FIFO 32768X18 15NS 80QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
| IDT72V283L6BC | 功能描述:IC FIFO 32768X18 6NS 100-BGA RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
| IDT72V283L6BCG | 制造商:Integrated Device Technology Inc 功能描述:IC FIFO 32768X18 6NS 100-BGA |
| IDT72V283L6PF | 功能描述:IC FIFO 32768X18 6NS 80QFP RoHS:否 类别:集成电路 (IC) >> 逻辑 - FIFO 系列:72V 标准包装:15 系列:74F 功能:异步 存储容量:256（64 x 4） 数据速率:- 访问时间:- 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:24-DIP（0.300"，7.62mm） 供应商设备封装:24-PDIP 包装:管件 其它名称:74F433 |
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