参数资料
型号: IDT79RC32H434-300BCGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 10/53页
文件大小: 0K
描述: IC MPU 32BIT CORE 300MHZ 256-BGA
标准包装: 90
系列: Interprise™
处理器类型: MIPS32 32-位
速度: 300MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 256-LBGA
供应商设备封装: 256-CABGA(17x17)
包装: 托盘
其它名称: 79RC32H434-300BCGI
18 of 53
January 19, 2006
IDT RC32434
Figure 4 COLD Reset Operation with External Boot Configuration Vector AC Timing Waveform
Note: For a diagram showing the COLD Reset Operation with Internal Boot Configuration Vector, see Figure 3.6 in the RC32434 User
Reference Manual.
1
1.
EXTBCV is asserted (i.e., pulled-up). COLDRSTN is asserted by external logic. The RC32434 responds by immediately tri-stating the bottom
16-bits of the memory and peripheral address bus (MADDR[15:0]), driving the remaining address bus signals (i.e., MADDR[21:16]), and
asserting RSTN. EXTCLK is undefined at this point.
2.
External logic drives the boot configuration vector on MADDR[15:0].
3.
External logic negates COLDRSTN and tri-states the boot configuration vector on MADDR[15:0]. In response, the RC32434 stops sampling
the boot configuration vector and retains the boot configuration vector value seen two clock cycles earlier (i.e., the value on the MADDR[15:0]
lines two rising edges of CLK earlier). Within 16 CLK clock cycles after COLDRSTN is sampled negated, the RC32434 begins driving
MADDR[15:0].
4.
The RC32434 waits for the PLL to stabilize.
5.
The RC32434 then begins generating EXTCLK.
6.
After at least 4000 CLK clock cycles, the RC32434 tri-states RSTN.
7.
At least 4000 CLK clock cycles after negating RSTN, the RC32434 samples RSTN. If RSTN is negated, cold reset has completed and the
RC32434 CPU begins executing by taking MIPS reset exception.
CLK
COLDRSTN
RSTN
MADDR[15:0]
MADDR[21:16]
2
EXTCLK
3
4
5
6
EXTBCV
4000 CLK
clock cycles
Boot Configuration Vector
Driven
*
* COLDRSTN sampled negated(high) by the RC32434
4000 CLK
clock cycles
相关PDF资料
PDF描述
IDT71V65703S85BG IC SRAM 9MBIT 85NS 119BGA
IDT79RC32H435-350BCG IC MPU 32BIT CORE 350MHZ 256-BGA
IDT79RC32H435-350BC IC MPU 32BIT CORE 350MHZ 256-BGA
ACB92DHAN-S329 EDGECARD PCI 184PS .050 R/A 3.3V
IDT79RC32H434-350BCG IC MPU 32BIT CORE 350MHZ 256-BGA
相关代理商/技术参数
参数描述
IDT79RC32H434-300BCI 功能描述:IC MPU 32BIT CORE 300MHZ 256-BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-350BC 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-350BCG 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-350BCGI 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-350BCI 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘