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参数资料
| 型号： | IDT85304-01 |
| 厂商： | Integrated Device Technology, Inc. |
| 英文描述： | LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER |
| 中文描述： | 低偏移，1至5差分至3.3伏的LVPECL扇出缓冲器 |
| 文件页数： | 9/11页 |
| 文件大小： | 77K |
| 代理商： | IDT85304-01 |
9
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT85304-01
LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the IDT85304-01. Equations and example calculations are also provided.
POWER DISSIPATION:
The total power dissipation for the IDT85304-01is the sumof the core power plus the power dissipated in the load(s). The following is the power dissipation
for the V
DD
= 3.3V + 5% = 3.465V, which gives worst case results. Please refer to the following section,
Calculations and Equations
, for details on calculating
power dissipated in the load.
Power (core)
MAX
= V
DD
_
MAX
*I
EE
_
MAX
= 3.465 *55mA = 190.57mW
Power (outputs)
MAX
= 30.2mW/Loaded Output Pair
If all outputs are loaded, the total power is 5 *30.2mW = 151mW
Total Power_
MAX
(3.465V, with all outputs switching) = 190.57mW + 151mW = 341.57mW
JUNCTION TEMPERATURE:
Junction temperature (t
J
) is the temperature at the junction of the bond wire and bond pad. It directly affects the reliability of the device. The maximum
recommended junction temperature for this device is 125°C.
The equation for is as follows: t
J
=
θ
JA
*Pd_total + T
A
t
J
= Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in
Power Dissipation
, above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance (
θ
JA
) must be used. Assumng a moderate air flow of 200
linear feet per mnute and a multi-layer board, the appropriate value is 77.6°C/W per the following
Thermal Resistance
table. Therefore, t
J
for an ambient
temperature of 70°C with all its outputs switching is:
70°C + 0.341W *77.6°C/W = 96.46°C. This is well below the limt of 125°C.
This calculation is only an example. t
J
will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and the type of board (single-
layer or multi-layer).
THERMAL RESISTANCE
θ
JA
for 20-pin TSSOP, forced convenction
θ
JA
by Velocity (Linear Feet per mInute)
0
200
77.6
400
70.9
Unit
°C/W
Multi-Layer PCB, JEDEC Standard Test boards
92.6
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| IDT85304-01PGG | 功能描述:IC CLOCK BUFFER MUX 1:5 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| IDT85304-01PGG8 | 功能描述:IC CLOCK BUFFER MUX 1:5 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| IDT85304-01PGGI | 功能描述:IC CLOCK BUFFER MUX 1:5 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 产品培训模块:High Bandwidth Product Overview 标准包装:1,000 系列:Precision Edge® 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:4 差分 - 输入:输出:是/是 输入:CML，LVDS，LVPECL 输出:CML 频率 - 最大:2.5GHz 电源电压:2.375 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) |
| IDT85304-01PGGI8 | 功能描述:IC CLOCK BUFFER MUX 1:5 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟缓冲器，驱动器 系列:- 标准包装:74 系列:- 类型:扇出缓冲器（分配） 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 输入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 输出:HCSL，LVDS 频率 - 最大:400MHz 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:管件 |
| IDT8535-01 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:LOW SKEW, 1-TO-4 LVCMOS-TO-3.3V LVPECL FANOUT BUFFER |
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