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参数资料
| 型号： | IP3088CX5 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 消费家电 |
| 英文描述： | Integrated 2, 4, 6 and 8-channel passive LC-filter network with ESD protection to IEC61000-4-2 level 4 |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PBGA5 |
| 封装： | 0.96 X 1.28 MM, 0.65 MM HEIGHT, GREEN, WLCSP-5 |
| 文件页数： | 2/15页 |
| 文件大小： | 284K |
| 代理商： | IP3088CX5 |
IP3088CX5_CX10_CX15_CX20_1
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 12 February 2010
10 of 15
NXP Semiconductors
IP3088CX5/CX10/CX15/CX20
2, 4, 6 and 8-channel passive LC-filter network with ESD protection
9.
Soldering of WLCSP packages
9.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
9.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
9.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 12) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 10.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 12.
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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