- 您现在的位置：买卖IC网 > PDF目录175852 > IP4337CX18 (NXP Semiconductors N.V.) 7-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 PDF资料下载
参数资料
| 型号： | IP4337CX18 |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 电路保护 |
| 英文描述： | 7-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 |
| 封装： | IP4337CX18/LF/P<NAX000|<<<1<Always Pb-free,;IP4337CX18/LF<NAX000|<<<1<Always Pb-free,; |
| 文件页数： | 12/12页 |
| 文件大小： | 70K |
| 代理商： | IP4337CX18 |
IP4337CX18LF_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 20 August 2009
9 of 12
NXP Semiconductors
IP4337CX18/LF
7-channel integrated lter network with ESD input protection
For further information on temperature proles, refer to application note
AN10365
“Surface mount reow soldering description”.
9.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefcient) differences between substrate and chip.
9.3.2 Quality of solder joint
A ip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reow can occur during the reow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
9.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 8.
Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
相关PDF资料 |
PDF描述 |
|---|---|
| IP4338CX24 | 10-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 |
| IP5-04-05.0-L-S-1-TR | INTERCONNECTION DEVICE |
| IPD1-117-01-L-D-02-20-P | INTERCONNECTION DEVICE |
| IPD1-118-01-F-D-02-20-P | INTERCONNECTION DEVICE |
| IPD1-113-01-S-D-02-30-P | INTERCONNECTION DEVICE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IP4337CX18/LF | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:7-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 |
| IP4337CX18/LF,135 | 功能描述:ESD 抑制器 7CH 70ohm 40MHz EMI filter,ESD PROTECTIN RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4337CX18/LF/P,13 | 功能描述:ESD 抑制器 7CH INTEG FLT w/ESD Input Protection RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4337CX18/LF/P+135 | 制造商:NXP Semiconductors 功能描述:Cut Tape 制造商:NXP Semiconductors 功能描述:0 |
| IP4338CX24 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:10-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 |
发布紧急采购，3分钟左右您将得到回复。