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参数资料
| 型号： | IP4350CX24 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 消费家电 |
| 英文描述： | 9-channel SD memory card interface ESD protection filter to IEC 61000-4-2 level 4 |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PBGA8 |
| 封装： | 1.95 X 2.11 MM, 0.61 MM HEIGHT, LEAD FREE, WLCSP-24 |
| 文件页数： | 12/16页 |
| 文件大小： | 110K |
| 代理商： | IP4350CX24 |
IP4350CX24_1
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 5 February 2010
12 of 16
NXP Semiconductors
IP4350CX24
9-channel SD memory card interface ESD protection filter
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”
10.3.1
Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
10.3.2
Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
10.3.3
Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IP4350CX24/LF,135 | 功能描述:ESD 抑制器 SD-Card, MMC T-flash Interface RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4352CX24 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4 |
| IP4352CX24/LF | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4 |
| IP4352CX24/LF,135 | 功能描述:ESD 抑制器 9CH SD MEMORY CARD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4353CX15/LF | 制造商:NXP Semiconductors 功能描述:Cut Tape |
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