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| 型号： | IR3081M |
| 厂商： | International Rectifier |
| 英文描述： | XPHASE VR 10.0 CONTROL IC |
| 中文描述： | XPHASE村10.0控制IC |
| 文件页数： | 6/20页 |
| 文件大小： | 396K |
| 代理商： | IR3081M |
IR3081
Page 6 of 20
9/1/03
SYSTEM THEORY OF OPERATION
XPhase
TM
Architecture
The
XPhase
TM
architecture is designed for multiphase interleaved buck converters which are used in applications
requiring small size, design flexibility, low voltage, high current and fast transient response. The architecture can be
used in any multiphase converter ranging from 1 to 16 or more phases where flexibility facilitates the design trade-
off of multiphase converters. The scalable architecture can be applied to other applications which require high
current or multiple output voltages.
As shown in Figure 1, the
XPhase
TM
architecture consists of a Control IC and a scalable array of phase converters
each using a single Phase IC. The Control IC communicates with the Phase ICs through a 5-wire analog bus, i.e.
bias voltage, phase timing, average current, error amplifier output, and VID voltage. The Control IC incorporates all
the system functions, i.e. VID, PWM ramp oscillator, error amplifier, bias voltage, and fault protections etc. The
Phase IC implements the functions required by the converter of each phase, i.e. the gate drivers, PWM comparator
and latch, over-voltage protection, and current sensing and sharing.
There is no unused or redundant silicon with the
XPhase
TM
architecture compared to others such as a 4 phase
controller that can be configured for 2, 3, or 4 phase operation. PCB Layout is easier since the 5 wire bus
eliminates the need for point-to-point wiring between the Control IC and each Phase. The critical gate drive and
current sense connections are short and local to the Phase ICs. This improves the PCB layout by lowering the
parasitic inductance of the gate drive circuits and reducing the noise of the current sense signal.
CONTROL BUS
0.1uF
CIN
CCS
RCS
CCS
RCS
0.1uF
VOUT+
VOUT SENSE-
VOUT-
12V
VID3
VID0
VID2
VID4
VOUT SENSE+
POWER GOOD
VR HOT
ENABLE
VID1
VID5
PHASE FAULT
IRU3081
CONTROL
IC
>> BIAS VOLTAGE
>> PHASE TIMING
>> PWM CONTROL
<< CURRENT SENSE
ADDITIONAL PHASES
INPUT/OUTPUT
IRU3086
PHASE
IC
COUT
CURRENT SHARE
CURRENT SHARE
IRU3086
PHASE
IC
>> VID VOLTAGE
PHASE FAULT
PHASE FAULT
PHASE HOT
PHASE HOT
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|---|---|
| IR3081MTR | XPHASE VR 10.0 CONTROL IC |
| IR3088A | XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| IR3088AM | XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| IR3088AMTR | XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| IR3092 | 2 PHASE OPTERON, ATHLON, OR VR10.X CONTROL IC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IR3081MPBF | 功能描述:IC PHASE CONTROLLER 28MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3081MTR | 功能描述:IC PHASE CONTROLLER 28L MLPQ RoHS:否 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3081MTRPBF | 功能描述:IC PHASE CONTROLLER 28-MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3082 | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASE AMD OPTERON/ATHLON 64 CONTROL IC |
| IR3082AMPBF | 功能描述:IC XPHASE CONTROL 9.6V 20-MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
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