参数资料
型号: IR3082MTRPBF
厂商: International Rectifier
文件页数: 32/33页
文件大小: 0K
描述: IC CTLR XPHASE 20-MLPQ
标准包装: 3,000
系列: XPhase™
应用: 处理器
电流 - 电源: 10mA
电源电压: 9.6 V ~ 16 V
工作温度: 0°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 20-MLPQ
供应商设备封装: 20-MLPQ(5x5)
包装: 带卷 (TR)
IR3082P b F
STENCIL DESIGN
? The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
? The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
land.
? The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit
approximately 50% area of solder on the center pad. If too much solder is deposited on the center pad
the part will float and the lead lands will be open.
? The maximum length and width of the land pad stencil aperture should be equal to the solder resist
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
Page 32 of 33
01/31/05
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