参数资料
| 型号： | IR3084MTRPBF |
| 厂商： | International Rectifier |
| 文件页数： | 42/45页 |
| 文件大小： | 0K |
| 描述： | IC CTLR XPHASE 28-MLPQ |
| 产品变化通告： | (EP) Parts Discontinuation 25/May/2012 |
| 标准包装： | 3,000 |
| 系列： | XPhase™ |
| 应用： | 处理器 |
| 电流 - 电源： | 14mA |
| 电源电压： | 9.5 V ~ 16 V |
| 工作温度： | 0°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-MLPQ |
| 供应商设备封装： | 28-MLPQ（5x5） |
| 包装： | 带卷 (TR) |
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IR3084
METAL AND SOLDER RESIST
? The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The
solder resist mis ? alignment is a maximum of 0.05mm and it is recommended that the lead lands are
all Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD
pads.
? The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
? At the inside corner of the solder resist where the lead land groups meet, it is recommended to
provide a fillet so a solder resist width of ≥ 0.17mm remains.
? The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis ? alignment. In 0.5mm pitch cases it is
allowable to have the solder resist opening for the land pad to be smaller than the part pad.
? Ensure that the solder resist in ? between the lead lands and the pad land is ≥ 0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
? The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger
than the diameter of the via.
? No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing
so can cause the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
Page 42 of 45
03/4/2009
相关PDF资料 |
PDF描述 |
|---|---|
| IR3084UMPBF | IC XPHASE CONTROL 28-MLPQ |
| IR3086AMPBF | IC PHASE CONTROLLER OVP 20MLPQ |
| IR3086MPBF | IC CONTROLLER PHASE 20MLPQ |
| IR3087MPBF | IC XPHASE W/OVP/TM CTRL 20MLPQ |
| IR3087M | IC XPHASE W/OVP/TM CTRL 20-MLPQ |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IR3084U | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASETM VR10, VR11 & OPTERON/ATHLON64 CONTROL IC |
| IR3084UMPBF | 功能描述:IC XPHASE CONTROL 28-MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:XPhase™ 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| IR3084UMTRPBF | 功能描述:开关变换器、稳压器与控制器 VR10 VR11 Athlon64 XPHASE CTRL IC RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| IR3086 | 制造商:IRF 制造商全称:International Rectifier 功能描述:PHASE IC WITH OVP, FAULT AND OVERTEMP DETECT |
| IR3086A | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASETM PHASE IC WITH OVP, FAULT AND OVERTEMP DETECT |
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