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参数资料
| 型号： | IR3093M |
| 厂商： | International Rectifier |
| 英文描述： | 3 PHASE OPTERON, ATHLON, OR VR10.X CONTROL IC |
| 中文描述： | 3相皓龙，速龙，或控制IC的VR10.X |
| 文件页数： | 34/39页 |
| 文件大小： | 693K |
| 代理商： | IR3093M |
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IR3093
Page 34 of 39
07/15/04
LAYOUT GUIDELINES
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout, therefore minimizing the noise coupled to the IC. Refer to the schematic in Figure 6
– System Diagram.
x
Dedicate at least one inner layer of the PCB as power ground plane (PGND).
x
The center pad of IC must be connected to ground plane (PGND) using the recommended via pattern shown in
“Package Dimensions”.
x
The IC’s PGND1, 2, 3 and LGND should connect to the center pad under IC.
x
The following components must be grounded directly to the LGND pin on the IC using a ground plane on the
component side of PCB: CSS, RSC2, RSC3, RSET, CVCC and C5VREF. The LGND should only be connected to
ground plan on the center pad under IC
x
Place the decoupling capacitors CVCC and CBIAS as close as possible to the VCC and VCCL1_2, VCCL3
pins. The ground side of CBIAS should not be connected to LGND and it should directly grounded through vias.
x
The following components should be placed as close as possible to the respective pins on the IC: RROSC,
ROCSET, CDAC, RDAC, CSS, CSC2, RSC2, CSC3, RSC3, RSET.
x
Place current sense capacitors CCS1, 2, 3 and resistors RCS1, 2, 3 as close as possible to CSINP1, 2, 3 pins
of IC and route the two current sense signals in pairs connecting to the IC. The current sense signals should be
located away from gate drive signals and switch nodes.
x
Use Kelvin connections to route the current sense traces to each individual phase inductor, in order to achieve
good current share between phases.
x
Place the input decoupling capacitors closer to the drain of top MOSFET and the source of the bottom
MOSFET. If possible, Use multiple smaller value ceramic caps instead of one big cap, or use low inductance type
of ceramic cap, to reduce the parasitic inductance.
x
Route the high current paths using wide and short traces or polygons. Use multiple vias for connections
between layers.
x
The symmetry of the following connections from phase to phase is important for proper operation:
- The Kelvin connections of the current sense signals to inductors.
- The gate drive signals from the IC to the MOSFETS.
- The polygon shape of switching nodes.
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相关代理商/技术参数 |
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| IR3093MPBF | 功能描述:IC VID VOLTAGE PROGRAMMER 48MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
| IR3093MTR | 制造商:IRF 制造商全称:International Rectifier 功能描述:3 PHASE OPTERON, ATHLON, OR VR10.X CONTROL IC |
| IR3093MTRPBF | 功能描述:IC CTLR 3PHASE VR10 48-MLQP RoHS:是 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR) |
| IR3094MPBF | 功能描述:IC REG CTRLR BUCK PWM VM 48MLPQ RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
| IR3094MTRPBF | 功能描述:开关变换器、稳压器与控制器 XPHASE VRD10 CTRL IC CTRL IC 200 to 700mV RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
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