参数资料
型号: IR3500MTRPBF
厂商: International Rectifier
文件页数: 44/47页
文件大小: 0K
描述: IC XPHASE3 CONTROLLER 32-MLPQ
产品变化通告: (EP) Parts Discontinuation 25/May/2012
标准包装: 1
系列: XPhase3™
应用: 处理器
电流 - 电源: 6.5mA
电源电压: 4.75 V ~ 7.5 V
工作温度: 0°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-MLPQ(5x5)
包装: 标准包装
产品目录页面: 1383 (CN2011-ZH PDF)
其它名称: IR3500MTRPBFDKR
IR3500
PCB METAL AND COMPONENT PLACEMENT
? Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥
0.2mm to minimize shorting.
? Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm inboard
extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard extension will
accommodate any part misalignment and ensure a fillet.
? Center pad land length and width should be equal to maximum part pad length and width. However, the minimum
metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper ( ≥ 0.1mm for 1 oz. Copper and ≥ 0.23mm for 3 oz.
Copper)
? Four 0.3mm diameter vias shall be placed in the pad land spaced at 1.2mm, and connected to ground to minimize
the noise effect on the IC and to transfer heat to the PCB.
? No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so can cause
the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
Page 44 of 47
May 18, 2009
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