参数资料
型号: IR3500MTRPBF
厂商: International Rectifier
文件页数: 45/47页
文件大小: 0K
描述: IC XPHASE3 CONTROLLER 32-MLPQ
产品变化通告: (EP) Parts Discontinuation 25/May/2012
标准包装: 1
系列: XPhase3™
应用: 处理器
电流 - 电源: 6.5mA
电源电压: 4.75 V ~ 7.5 V
工作温度: 0°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-MLPQ(5x5)
包装: 标准包装
产品目录页面: 1383 (CN2011-ZH PDF)
其它名称: IR3500MTRPBFDKR
IR3500
SOLDER RESIST
? The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist
mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask
Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm.
? At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a
solder resist width of ≥ 0.17mm remains.
? The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the copper
of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have the solder
resist opening for the land pad to be smaller than the part pad.
? Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of
the solder resist strip separating the lead lands from the pad land.
? The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
Page 45 of 47
May 18, 2009
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