参数资料
型号: IR3621MPBF
厂商: International Rectifier
文件页数: 2/29页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM VM 32MLPQ
标准包装: 73
PWM 型: 电压模式
输出数: 2
频率 - 最大: 345kHz
占空比: 86.5%
电源电压: 5.5 V ~ 14.5 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 32-VFQFN 裸露焊盘
包装: 管件
配用: IRDC3621-ND - BOARD EVAL DUAL SYNC BUCK CTRLR
IR3621 & (PbF)
ABSOLUTE MAXIMUM RATINGS
Vcc, V CL Supply Voltage ...........................................
VcH1 and VcH2 Supply Voltage ................................
PGOOD....................................................................
Storage Temperature Range ......................................
Junction Temperature Range .....................................
ESD Classification ...................................................
-0.5V To 16V
-0.5V To 25V
-0.5V To 16V
-55°C To 150°C
-40°C To 150°C
JEDEC, JESD22-A114
Caution: Stresses above those listed in “Absolute Maximum Rating” may cause permanent damage to the device. These are stress
ratings only and function of the device at these or any other conditions beyond those indicated in the operational sections of the specifica-
tions is not implied. Exposure to “Absolute Maximum Rating” conditions for extended periods may affect device reliability
RECOMMENDED OPERATING CONDITIONS
Parameter
Vcc
VcH1,2
Fs
Tj
Definition
Supply Voltage
Supply Voltage
Operating Frequency
Junction Temperature
Min
5.5
10
200
-40
Max
14.5
20
500
125
Units
V
V
kHz
°C
PACKAGE INFORMATION
IR3621F
28-PIN TSSOP (F)
IR3621M & IR3621MPbF
32-Lead MLPQ 5mmx5mm (M)
PGood 1
28 Gnd
V CC 2
V OUT3 3
Rt 4
27 V REF
26 V P2
25 Hiccup
Rt
1
32
31
30
29
28 27
26
25
24 Hiccup
V SEN2 5
Fb2 6
24 Sync
23 V SEN1
V SEN2
Fb2
2
3
23 Sync
22 V SEN1
Comp2 7
SS2 / SD 8
22 Fb1
21 Comp1
Comp2
SS2/SD2
4
5
Pad
21 Fb1
20 Comp1
OCSet2 9
20 SS1 / SD
VcH2 10
19 OCSet1
OCSet2 6
19 SS1/SD1
HDrv2 11
18 VcH1
VCH2
7
18 OCSet1
PGnd2 12
LDrv2 13
V CL 14
17 HDrv1
16 PGnd1
15 LDrv1
HDrv2
8
9
10
11
12
13
14
15
16
17
VcH1
2
θ JA = 75.5 ° C/W
θ JC =13.3 ° C/W
θ JA = 36.0 ° C/W
θ JC = 1.0 ° C/W
Exposed pad on underside is connected to a copper
pad through vias for 4-layer PCB board design.
www.irf.com
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