参数资料
型号: IR3628MPBF
厂商: International Rectifier
文件页数: 17/22页
文件大小: 0K
描述: IC CTLR PWM BUCK SYNC 12-MLPD
标准包装: 122
应用: 控制器,DDR
输入电压: 4.5 V ~ 14 V
输出数: 1
输出电压: 0.6 V ~ 9.94 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 12-VFDFN 裸露焊盘
供应商设备封装: 12-MLPD
包装: 管件
IR3628MP b F
I SET = I L ( critical ) =
R OCSet ? I OCSet
Programming the Current-Limit
The Current-Limit threshold can be set by
connecting a resistor (R SET ) from drain of low
side MOSFET to the OCSet pin. The resistor
can be calculated by using equation (3).
The R DS(on) has a positive temperature
coefficient and it should be considered for the
worse case operation. This resistor must be
placed close to the IC, place a location for small
ceramic capacitor from this pin to ground for
noise rejection purposes.
--( 3 )
R DS ( on )
R DS ( on ) = 3 . 8 m Ω ? 1 . 5 = 5 . 7 m Ω
I SET ? I o ( LIM ) = 10 A ? 1 . 5 = 15 A
(50% over nominal output current)
R OCSet = 4 . 27 K Ω Select R 7 = 4 . 32 K Ω
Layout Consideration
The layout is very important when designing high
frequency switching converters. Layout will affect
noise pickup and can cause a good design to
perform with less than expected results.
Start to place the power components, make all
the connection in the top layer with wide, copper
filled areas.
08/10/2007
The inductor, output capacitor and the MOSFET
should be close to each other as possible. This
helps to reduce the EMI radiated by the power
traces due to the high switching currents through
them. Place input capacitor directly to the drain of
the high-side MOSFET, to reduce the ESR
replace the single input capacitor with two
parallel units.
The feedback part of the system should be kept
away from the inductor and other noise sources.
The critical bypass components such as
capacitors for Vcc and Vc should be close to
respective pins. It is important to place the
feedback components include feedback resistors
and compensation components close to Fb and
Comp pins.
In multilayer PCB use one layer as power ground
plane and have a control circuit ground (analog
ground), to which all signals are referenced. The
goal is to localize the high current path to a
separate loop that does not interfere with the
more sensitive analog control function. These two
grounds must be connected together on the PC
board layout at a single point.
The MLPD is thermal enhanced package, based
on thermal performance it is recommended to
use 4-layers PCB. To effectively remove heat
from the device the exposed pad should be
connected to ground plane using vias.
17
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