参数资料
型号: IRDC3640
厂商: International Rectifier
文件页数: 15/17页
文件大小: 0K
描述: BOARD EVAL SYNC BUCK CONTROLLER
标准包装: 1
系列: *

IRDC3640
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm.
The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead
lands are all Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always
ensure NSMD pads.
The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where
the lead land groups meet, it is recommended to provide a fillet so a solder resist width of ≥
0.17mm remains.
The land pad should be Non Solder Mask Defined (NSMD), with a minimum pullback of the
solder resist off the copper of 0.06mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to
the high aspect ratio of the solder resist strip separating the lead lands from the pad land.
Each via in the land pad should be tented or plugged from bottom boardside with solder resist.
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