参数资料
型号: IRDC3640
厂商: International Rectifier
文件页数: 16/17页
文件大小: 0K
描述: BOARD EVAL SYNC BUCK CONTROLLER
标准包装: 1
系列: *

IRDC3640
Stencil Design
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The stencil apertures for the lead lands should be approximately 80% of the area of the
lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead
shorts. Since for 0.5mmpitch devices the leads are only 0.25mm wide, the stencil
apertures should not be made narrower; openings in stencils < 0.25mm wide are difficult
to maintain repeatable solder release.
The stencil lead land apertures should therefore be shortened in length by 80% and
centered on the lead land.
The land pad aperture should deposit approximately 50% area of solder on the center
pad. If too much solder is deposited on the center pad the part will float and the lead
lands will be open.
The maximum length and width of the land pad stencil aperture should be equal to the
solder resist opening minus an annular 0.2mm pull back to decrease the incidence of
shorting the center land to the lead lands when the part is pushed into the solder paste.
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