参数资料
型号: IRDC3870
厂商: International Rectifier
文件页数: 19/20页
文件大小: 0K
描述: BOARD EVAL REG SUPIRBUCK DC/DC
产品变化通告: (EP) Parts Discontinuation 25/May/2012
标准包装: 1
系列: *
IR3870MPBF
Stencil Design
The Stencil apertures for the lead lands should be approximately 80% of the area of the lead lads.
Reducing the amount of solder deposited will minimize the occurrences of lead shorts. If too much
solder is deposited on the center pad the part will float and the lead lands will open.
The maximum length and width of the land pad stencil aperture should be equal to the solder resist
opening minus an annular 0.2mm pull back in order to decrease the risk of shorting the center land
to the lead lands when the part is pushed into the solder paste.
19
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