参数资料
型号: IRF1010ESTRR
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET N-CH 60V 84A D2PAK
标准包装: 800
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 84A
开态Rds(最大)@ Id, Vgs @ 25° C: 12 毫欧 @ 50A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 130nC @ 10V
输入电容 (Ciss) @ Vds: 3210pF @ 25V
功率 - 最大: 200W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
PD - 91720
IRF1010ES
IRF1010EL
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Advanced Process Technology
Surface Mount (IRF1010ES)
HEXFET ? Power MOSFET
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Low-profile through-hole (IRF1010EL)
175 ° C Operating Temperature
Fast Switching
Fully Avalanche Rated
D
V DSS = 60V
R DS(on) = 12m ?
Description
Advanced HEXFET ? Power MOSFETs from International
Rectifier utilize advanced processing techniques to
G
S
I D = 84A ?
achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in a wide
variety of applications.
The D 2 Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D 2 Pak is suitable for high current applications because of its
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRF1010EL) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
D 2 Pak
IRF1010ES
Max.
TO-262
IRF1010EL
Units
I D @ T C = 25 ° C
Continuous Drain Current, V GS @ 10V
84 ?
I D @ T C = 100 ° C
I DM
P D @T C = 25 ° C
V GS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current ?
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current ?
Repetitive Avalanche Energy ?
Peak Diode Recovery dv/dt ?
59
330
200
1.4
± 20
50
17
4.0
A
W
W/ ° C
V
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
-55 to + 175
300 (1.6mm from case )
10 lbf ? in (1.1N ? m)
° C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
R θ JA
Junction-to-Case
Junction-to-Ambient (PCB mount)**
–––
–––
0.75
40
° C/W
www.irf.com
1
02/14/02
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