参数资料
型号: IRF5305S
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET P-CH 55V 31A D2PAK
标准包装: 50
系列: HEXFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 31A
开态Rds(最大)@ Id, Vgs @ 25° C: 60 毫欧 @ 16A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 63nC @ 10V
输入电容 (Ciss) @ Vds: 1200pF @ 25V
功率 - 最大: 3.8W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 管件
其它名称: *IRF5305S
PD - 91386C
IRF5305S/L
HEXFET ? Power MOSFET
l
Advanced Process Technology
l
l
Surface Mount (IRF5305S)
Low-profile through-hole (IRF5305L)
D
V DSS = -55V
l 175°C Operating Temperature
l Fast Switching
l P-Channel
l Fully Avalanche Rated
Description
G
S
R DS(on) = 0.06 ?
I D = -31A
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D 2 Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
D P ak
highest  power  capability  and  the  lowest  possible  on-
resistance in any existing surface mount package. The
D 2 Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF5305L) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
2
Max.
T O -26 2
Units
I D @ T C = 25°C
Continuous Drain Current, V GS @ -10V ?
-31
I D @ T C = 100°C
I DM
P D @T A = 25°C
P D @T C = 25°C
V GS
E AS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ -10V ?
Pulsed Drain Current ??
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy ??
Avalanche Current ?
Repetitive Avalanche Energy ?
Peak Diode Recovery dv/dt ??
-22
-110
3.8
110
0.71
± 20
280
-16
11
-5.8
A
W
W
W/°C
V
mJ
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-55 to + 175
300 (1.6mm from case )
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
R θ JA
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
–––
–––
1.4
40
°C/W
4/1/99
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