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参数资料
| 型号： | IRFR5505 |
| 厂商： | International Rectifier |
| 英文描述： | P Channel Surface Mount HEXFET Power MOSFET(P沟道表贴型HEXFET功率MOS场效应管) |
| 中文描述： | P通道表面贴装HEXFET功率MOSFET的性（P沟道表贴型的HEXFET功率马鞍山场效应管） |
| 文件页数： | 1/10页 |
| 文件大小： | 108K |
| 代理商： | IRFR5505 |
IRFR/U5505
HEXFET
Power MOSFET
V
DSS
= -55V
R
DS(on)
= 0.11
I
D
= -18A
8/25/97
Parameter
Typ.
–––
–––
–––
Max.
2.2
50
110
Units
R
θ
JC
R
θ
JA
R
θ
JA
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Junction-to-Ambient
°C/W
Thermal Resistance
D-Pak
TO-252A A
I-Pak
TO-251AA
l
Ultra Low On-Resistance
l
P-Channel
l
Surface Mount (IRFR5505)
l
Straight Lead (IRFU5505)
l
Advanced Process Technology
l
Fast Switching
l
Fully Avalanche Rated
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
Parameter
Max.
-18
-11
-64
57
0.45
± 20
150
-9.6
5.7
-5.0
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
A
W
W/°C
V
mJ
A
mJ
V/ns
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
-55 to + 150
300 (1.6mm from case )
°C
Absolute Maximum Ratings
The D-Pak is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
S
D
G
PD - 9.1610B
相关PDF资料 |
PDF描述 |
|---|---|
| IRFRU6215 | Power MOSFET(Vdss=-150V, Rds(on)=0.295ohm, Id=-13A) |
| IRFU6215 | CAP 0.22UF 25V 10% X7R SMD-1206 TR-7-PL 3K/REEL |
| IRFR6215 | Power MOSFET(Vdss=-150V, Rds(on)=0.295ohm, Id=-13A) |
| IRFRU9024N | Power MOSFET(Vdss=-55V, Rds(on)=0.175ohm, Id=-11A) |
| IRFU9024N | CAP 0.22UF 50V 10% X7R SMD-1206 TR-7-PL 3K/REEL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IRFR5505CPBF | 功能描述:MOSFET P-CH 55V 18A DPAK RoHS:是 类别:分离式半导体产品 >> FET - 单 系列:HEXFET® 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| IRFR5505CTRLPBF | 功能描述:MOSFET P-CH 55V 18A DPAK RoHS:是 类别:分离式半导体产品 >> FET - 单 系列:HEXFET® 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件 |
| IRFR5505GPBF | 制造商:IRF 制造商全称:International Rectifier 功能描述:Ultra Low On-Resistance |
| IRFR5505GTRPBF | 功能描述:MOSFET MOSFT PCh -55V -18A 110mOhm 21.3nC RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| IRFR5505HR | 制造商:International Rectifier 功能描述:Trans MOSFET P-CH 55V 18A 3-Pin(2+Tab) DPAK T/R |
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