参数资料
型号: IRFU9024N
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET P-CH 55V 11A I-PAK
标准包装: 75
系列: HEXFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 11A
开态Rds(最大)@ Id, Vgs @ 25° C: 175 毫欧 @ 6.6A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 19nC @ 10V
输入电容 (Ciss) @ Vds: 350pF @ 25V
功率 - 最大: 38W
安装类型: 通孔
封装/外壳: TO-251-3 长引线,IPak,TO-251AB
供应商设备封装: I-Pak
包装: 管件
其它名称: *IRFU9024N
PD - 9.1506
PRELIMINARY
IRFR/U9024N
HEXFET ? Power MOSFET
l
l
l
l
l
l
l
Ultra Low On-Resistance
P-Channel
Surface Mount (IRFR9024N)
Straight Lead (IRFU9024N)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated
G
D
S
V DSS = -55V
R DS(on) = 0.175 ?
I D = -11A
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
D -P a k
I-P a k
The D-Pak is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for through-
hole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
Absolute Maximum Ratings
Parameter
T O -2 52 A A
Max.
TO -2 5 1 A A
Units
I D @ T C = 25°C
Continuous Drain Current, V GS @ -10V
-11
I D @ T C = 100°C
I DM
P D @T C = 25°C
V GS
E AS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ -10V
Pulsed Drain Current ?
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy ?
Avalanche Current ?
Repetitive Avalanche Energy ?
Peak Diode Recovery dv/dt ?
-8
-44
38
0.30
± 20
62
-6.6
3.8
-10
A
W
W/°C
V
mJ
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-55 to + 150
300 (1.6mm from case )
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
Junction-to-Case
–––
3.3
R θ JA
R θ JA
Junction-to-Ambient (PCB mount)**
Junction-to-Ambient
–––
–––
50
110
°C/W
6/26/97
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