参数资料
型号: IRFZ44NSTRR
厂商: International Rectifier
文件页数: 1/11页
文件大小: 0K
描述: MOSFET N-CH 55V 49A D2PAK
标准包装: 800
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 49A
开态Rds(最大)@ Id, Vgs @ 25° C: 17.5 毫欧 @ 25A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 63nC @ 10V
输入电容 (Ciss) @ Vds: 1470pF @ 25V
功率 - 最大: 3.8W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
PD - 94153
IRFZ44NS
l
l
l
Advanced Process Technology
Surface Mount (IRFZ44NS)
Low-profile through-hole (IRFZ44NL)
IRFZ44NL
HEXFET ? Power MOSFET
l
l
175°C Operating Temperature
Fast Switching
D
V DSS = 55V
l Fully Avalanche Rated
Description
Advanced HEXFET ? Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well known
for, provides the designer with an extremely efficient and
reliable device for use in a wide variety of applications.
The D 2 Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The D 2 Pak is suitable
G
S
R DS(on) = 0.0175 ?
I D = 49A
D P ak
for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a
typical surface mount application.
The through-hole version (IRFZ44NL) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
Max.
2
T O -26 2
Units
I D @ T C = 25 ° C
Continuous Drain Current, V GS @ 10V
49
I D @ T C = 100 ° C
I DM
P D @T A = 25 ° C
P D @T C = 25 ° C
V GS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current ?
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current ?
Repetitive Avalanche Energy ?
Peak Diode Recovery dv/dt ?
35
160
3.8
94
0.63
± 20
25
9.4
5.0
A
W
W
W/ ° C
V
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-55 to + 175
300 (1.6mm from case )
° C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
Junction-to-Case
–––
1.5
R θ JA
Junction-to-Ambient
–––
40
° C/W
www.irf.com
1
03/13/01
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