参数资料
型号: IRHF7230
厂商: International Rectifier
英文描述: HEXFET Transistor(HEXFET MOS场效应管)
中文描述: 的HEXFET晶体管(马鞍山的HEXFET场效应管)
文件页数: 3/12页
文件大小: 302K
代理商: IRHF7230
IRHF7230, IRHF8230,JANSR-,JANSH-,2N7262 Devices
www.irf.com
3
Radiation Performance of Rad Hard HEXFETs
International Rectifier Radiation Hardened HEXFETs
are tested to verify their hardness capability. The hard-
ness assurance program at International Rectifier
comprises three radiation environments.
Table 1. Low Dose Rate
Parameter
IRHF7230
100K Rads (Si) 1000K Rads (Si)
Units
Min
Max
Min
200
200
2.0
4.0
1.25
100
-100
25
1.225
IRHF8230
Test Conditions
Max
4.5
100
-100
50
1.68
BV
DSS
V
GS(th)
I
GSS
I
GSS
I
DSS
R
DS(on)1
Drain-to-Source Breakdown Voltage
Gate Threshold Voltage
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Zero Gate Voltage Drain Current
Static Drain-to-Source
On-State Resistance One
Diode Forward Voltage
V
V
GS
= 0V, I
D
= 1.0mA
V
GS
= V
DS
, I
D
= 1.0mA
V
GS
= 20V
V
GS
= -20 V
V
DS
=0.8 x Max Rating, V
GS
=0V
V
GS
= 12V, I
D
= 3.5A
nA
μA
V
SD
1.4
1.4
V
TC = 25°C, IS =5.5A,V
GS
= 0V
Every manufacturing lot is tested in a low dose rate
(total dose) environment per MIL-STD-750, test
method 1019 condition A. International Rectifier has
imposed a standard gate condition of 12 volts per
note 6 and a V
bias condition equal to 80% of the
device rated voltage per note 7. Pre- and post- irra-
diation limits of the devices irradiated to 1 x 10
5
Rads
(Si) are identical and are presented in Table 1, col-
umn 1, IRHF7230. Post-irradiation limits of the devices
irradiated to 1 x 10
6
Rads (Si) are presented in Table
1, column 2, IRHF8230. The values in Table 1 will be
met for either of the two low dose rate test circuits that
are used. Both pre- and post-irradiation performance
are tested and specified using the same drive circuitry
and test conditions in order to provide a direct com-
parison.
High dose rate testing may be done on a special
request basis using a dose rate up to 1 x 10
12
Rads
(Si)/Sec (See Table 2).
International Rectifier radiation hardened HEXFETs
have been characterized in heavy ion Single Event
Effects (SEE) environments. Single Event Effects char-
acterization is shown in Table 3.
Radiation Characteristics
Table 2. High Dose Rate
10
11
Rads (Si)/sec 10
12
Rads (Si)/sec
Min Typ Max
160
Parameter
Drain-to-Source Voltage
Min Typ Max
Units
160
Test Conditions
V
DSS
V
Applied drain-to-source voltage during
gamma-dot
Peak radiation induced photo-current
8.0 A/μsec Rate of rise of photo-current
μH
Circuit inductance required to limit di/dt
IPP
di/dt
L1
1.0
20
160
20
20
A
Table 3. Single Event Effects
LET (Si)
Fluence Range V
DS
Bias V
GS
Bias
Ion
(MeV/mg/cm
2
) (ions/cm
2
) (μm) (V) (V)
Cu 28
3x 10
5
~43 180
-5
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