参数资料
型号: IRL5602S
厂商: International Rectifier
文件页数: 2/9页
文件大小: 0K
描述: MOSFET P-CH 20V 24A D2PAK
标准包装: 50
系列: HEXFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 24A
开态Rds(最大)@ Id, Vgs @ 25° C: 42 毫欧 @ 12A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 44nC @ 4.5V
输入电容 (Ciss) @ Vds: 1460pF @ 15V
功率 - 最大: 75W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 管件
其它名称: *IRL5602S
Q803261
IRL5602S
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ. Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
-20
––– ––– V V GS = 0V, I D = -250μA
D V (BR)DSS / D T J
Breakdown Voltage Temp. Coefficient
–––
-0.013 –––
V/°C Reference to 25°C, I D = -1mA ?
–––
––– 0.042 V GS = -4.5V, I D = -12A ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
––– 0.062
W
V GS = -2.7V, I D = -10A
?
–––
––– 0.075 V GS = -2.5V, I D = -10A
?
μA
ns
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
-0.7
12
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––– -1.0 V V DS = V GS , I D = -250μA
––– ––– S V DS = -15V, I D = -12A ?
––– -25 V DS = -20V, V GS = 0V
––– -250 V DS = -16V, V GS = 0V, T J = 150°C
––– 500 V GS = -8.0V
nA
––– -500 V GS = 8.0V
––– 44 I D = -12A
––– 8.7 nC V DS = -16V
––– 19 V GS = -4.5V, See Fig. 6 and 13 ??
9.7 ––– V DD = -10 V
73 ––– I D = -12A
53 ––– R G = 6.0 W , V GS = 4.5V
84 ––– R D = 0.8 W , See Fig. 10 ??
L S
Internal Source Inductance
–––
7.5
–––
nH
Between lead,
and center of die contact
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
1460 ––– V GS = 0V
790 ––– pF V DS = -15V
370 ––– ? = 1.0MHz, See Fig. 5 ?
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
––– –––
––– –––
-24
-96
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
Diode Forward Voltage
––– ––– -1.4 V T J = 25°C, I S = -12A, V GS = 0V
?
t rr
Q rr
t on
Notes:
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
––– 58 88 ns T J = 25°C, I F = -12A
––– 54 81 nC di/dt = -100A/μs ?
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? Starting T J = 25°C, L = 3.0mH
R G = 25 W , I AS = -14A. (See Figure 12)
? I SD £ -12A, di/dt £ 120A/μs, V DD £ V (BR)DSS ,
T J £ 175°C
? Pulse width £ 300μs; duty cycle £ 2%.
** When mounted on FR-4 board using minimum recommended footprint.
For recommended footprint and soldering techniques refer to application note #AN-994.
2
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