参数资料
型号: IRMD2214SS
厂商: International Rectifier
文件页数: 5/22页
文件大小: 0K
描述: KIT DESIGN EVAL BOARD IR2214SS
标准包装: 1
系列: HVIC
主要目的: 电源管理,半 H 桥驱动器(外部 FET)
已用 IC / 零件: IR2214SS
已供物品: 板,文档
相关产品: IR22141SSTRPBF-ND - IC DVR HALF BRIDGE IC 24SSOP
IR2214SSTRPBF-ND - IC DVR HALF BRIDGE IC 24SSOP
IR2214SSPBF-ND - IC DRIVER HALF BRIDGE SGL 24SSOP
IR22141SSPBF-ND - IC DRIVER HALF BRIDGE SGL 24SSOP
IR2214SS-ND - IC DRIVER HALF BRIDGE SGL 24SSOP
IR22141SS-ND - IC DRIVER HALF BRIDGE SGL 24SSOP
其它名称: *IRMD2214SS
Datasheet rev 2.1
IRMD22141SS
FLT_CLR is active high and it is used to reset the fault state of all devices (see also the Fault
management section and the IR22141SS datasheet).
FAULT/SD logic signal
This is an input/output logic signal, 3.3 V compatible CMOS I/O port. The logic signal is active low, tied
to connector VCC with a 10 k pull-up resistor. As an input, the signal shuts down (SD) all the drivers;
as an output, it reports the power module fault (IGBT desaturation detection) or the VCC undervoltage
(see also IR22141SS datasheet for more information).
On board a red LED (DL2) indicates when the signal is active; Figure 2a shows the connection.
VCC supply pin
This is the supply pin for all the devices. On board a green LED (DL1) indicates the supply power on;
Figure 2b shows the connection.
V CC
FAULT/SD
(a)
15k
Red
V CC
GND
(b)
15k
Green
Figure 2: LED connection
VSS ground pin (GND)
The board ground is connected to the power module DC- pin. The VSS pin of the connector and the
devices ground pin are star-connected to the DC- pin. DC- star connection has been chosen to reduce
the noise coupled from the floating signals.
Connecting the current sensors
P1, P2 and P3 are connected with the optional shunt resistors placed on the phase output nodes.
CONNECTOR P1
SHU+
(motor side)
SHU-
(power module side)
U
1
2
3
1
2
3
CONNECTOR P2
SHV+
(motor side)
SHV-
(power module side)
V
1
2
3
1
2
3
CONNECTOR P3
SHW+
(motor side)
SHW-
(power module side)
W
1
2
3
1
2
3
Table 2: P1, P2 and P3 connectors for kelvin contacts to shunt signals
Sep 9 , 2004
www.irf.com
page 5/22
th
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