参数资料
型号: ISB35484
厂商: 意法半导体
英文描述: HCMOS STRUCTURED ARRAY
中文描述: HCMOS结构化阵列
文件页数: 10/15页
文件大小: 345K
代理商: ISB35484
PACKAGE AVAILABILITY
The ISB28000 Series is designed to be compatible
with QFP, BGA and SBC package types, in addition
to the more traditional types found.
The options include Plastic Leaded Chip Carriers
(PLCC) from 28 to 84 pins, while the Metric Quad
Flat Pack (xQFP) offering ranges up to 304 pins.
Both high performance and high power variants are
available as well as the TQFP thin types.
Ball Grid Array (BGA) packages are available from
160 to 500 pins and SBC types allow the pin count
to reach the area of 1000 pins.
Pin counts for through board mounting range up to
299. For higher pin counts the range is compatible
with the industry standard JEDEC and EIA-J Guar-
dring Quad Flatpack (GQPF) with pin counts from
186 to 304.
The diversity in pin count and package style gives
the designer the opportunity to find the best com-
promise for system size, cost and performance
requirements.
All packages for the military market are hermetically
sealed to meet MIL-STD-883 Method. Prototypes
are developed in ceramic packages for fast turn-
around evaluation.
0
100
200
300
PIN COUNT
400
500
600
700
Plastic Chip Carrier
Pin Grid Array
BGA and HP BGA
Plastic Quad Flatpack
Guardring Quad GQFP
NOW
PLANNED
Power QFP Spreader
and Slug based
Thin Quad Flatpack
80
304
64
447
44 84
225 700+
44 144
44 304
208 304
Lead Pitch
0.5&0.65 mm
0.5mm
0.5&0.65 mm
0.5mm
Large
Large
Large
ISB35_VB
Figure 6. Packaging Capability
ISB35000 SERIES
10/15
相关PDF资料
PDF描述
ISB35666 HCMOS STRUCTURED ARRAY
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ISC-1210 Surface Mount, Molded, Shielded Inductor
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