参数资料
| 型号： | ISL12024IRTCZ |
| 厂商： | Intersil |
| 文件页数： | 14/24页 |
| 文件大小： | 0K |
| 描述： | IC RTC/CALENDER 64BIT 8-TDFN |
| 标准包装： | 100 |
| 类型： | 时钟/日历 |
| 特点： | 警报器，闰年，唯一 ID |
| 时间格式： | HH:MM:SS（12/24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 电压 - 电源，电池： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TDFN |
| 供应商设备封装： | 8-TDFN（3x3） |
| 包装： | 管件 |
21
FN6749.1
December 15, 2011
Layout Considerations
The crystal input at X1 has a very high impedance and will
pick up high frequency signals from other circuits on the
board. Since the X2 pin is tied to the other side of the crystal,
it is also a sensitive node. These signals can couple into the
oscillator circuit and produce double clocking or
mis-clocking, seriously affecting the accuracy of the RTC.
Care needs to be taken in layout of the RTC circuit to avoid
noise pickup. Figure 23 is a suggested layout for the 8 Ld
SOIC package.
The X1 and X2 connections to the crystal are to be kept as
short as possible. A thick ground trace around the crystal is
advised to minimize noise intrusion, but ground near the X1
and X2 pins should be avoided as it will add to the load
capacitance at those pins. Keep in mind these guidelines for
other PCB layers in the vicinity of the RTC device. A small
decoupling capacitor at the VDD pin of the chip is mandatory,
with a solid connection to ground.
The ISL12024IRTCZ product has a special consideration.
The IRQ/FOUT pin on the 8 Ld TDFN package is located
next to the X2 pin. When this pin is used as a frequency
output (IRQ/FOUT) and is set to 32.768kHz noise can couple
to the X1 or X2 pins and cause double-clocking. The layout
away from the X1 and X2 pins. Also, reducing the switching
current at this pin by careful selection of the pull-up resistor
value will reduce noise. Intersil suggests a minimum value of
5.1k
Ω for 32.768kHz, and higher values (up to 20kΩ) for
lower frequency IRQ/FOUT outputs.
For other RTC products, the same rules stated above should
be observed, but adjusted slightly since the packages and
pinouts are different.
Oscillator Measurements
When a proper crystal is selected and the layout guidelines
above are observed, the oscillator should start-up in most
circuits in less than one second. Some circuits may take
slightly longer, but startup should definitely occur in less than
5 seconds. When testing RTC circuits, the most common
impulse is to apply a scope probe to the circuit at the X2 pin
(oscillator output) and observe the waveform. DO NOT DO
THIS! Although in some cases you may see a usable
waveform, due to the parasitics (usually 10pF to ground)
applied with the scope probe, there will be no useful
information in that waveform other than the fact that the
circuit is oscillating. The X2 output is sensitive to capacitive
impedance so the voltage levels and the frequency will be
affected by the parasitic elements in the scope probe.
Applying a scope probe can possibly cause a faulty oscillator
to start-up, hiding other issues (although in the Intersil RTCs,
the internal circuitry assures startup when using the proper
crystal and layout).
The best way to analyze the RTC circuit is to power it up and
read the real-time clock as time advances, or if the chip has
the IRQ/FOUT output, look at the output of that pin on an
oscilloscope (after enabling it with the control register, and
using a pull-up resistor for an open-drain output). Alternatively,
the ISL12024IRTCZ device has an IRQ/FOUT output which
can be checked by setting an alarm for each minute. Using
the pulse interrupt mode setting, the once-per-minute interrupt
functions as an indication of proper oscillation.
Backup Battery Operation
Many types of batteries can be used with the Intersil RTC
products. 3.0V or 3.6V Lithium batteries are appropriate, and
sizes are available that can power a Intersil RTC device for up
TABLE 7. CRYSTAL MANUFACTURERS
MANUFACTURER
PART NUMBER
TEMP RANGE (°C)
+25°C FREQUENCY TOLERANCE (PPM)
Citizen
CM201, CM202, CM200S
-40 to +85
±20
Epson
MC-405, MC-406
-40 to +85
±20
Raltron
RSM-200S-A or B
-40 to +85
±20
SaRonix
32S12A or B
-40 to +85
±20
Ecliptek
ECPSM29T-32.768K
-10 to +60
±20
ECS
ECX-306/ECX-306I
-10 to +60
±20
Fox
FSM-327
-40 to +85
±20
FIGURE 23. SUGGESTED LAYOUT FOR INTERSIL RTC IN 8
Ld SOIC PACKAGE
ISL12024IRTC
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相关代理商/技术参数 |
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| ISL12024IRTCZ-T | 功能描述:实时时钟 RTC OUTPUT PROGRAM TO 32KHZ W/EEPROM 8 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| ISL12024IVZ | 功能描述:实时时钟 REAL TIME CLK/CLNDR W/EEPROM IN 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| ISL12024IVZ-T | 功能描述:实时时钟 REAL TIME CLK/CLNDR W/EEPROM IN 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| ISL12025 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Real-Time Clock/Calendar with EEPROM |
| ISL12025IBZ | 功能描述:实时时钟 REAL TIME CLK/CLNDR W/EEPROM 2 63VSET RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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