参数资料
型号: ISL22326UFV14Z
厂商: Intersil
文件页数: 8/15页
文件大小: 0K
描述: IC POT DGTL 128TP LN LP 14-TSSOP
标准包装: 960
系列: XDCP™
接片: 128
电阻(欧姆): 50k
电路数: 2
温度系数: 标准值 ±80 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 14-TSSOP
包装: 管件
2
FN6176.2
September 8, 2009
Block Diagram
I2C
INTERFACE
VCC
RH0
RH1
GND
RL0
RL1
RW0
RW1
SCL
SDA
A0
A1
A2
WR1
WR0
SHDN
POWER-UP
INTERFACE,
CONTROL
AND STATUS
LOGIC
NON-
VOLATILE
REGISTERS
Pin Descriptions
TSSOP PIN
NUMBER
QFN PIN
NUMBER
PIN NAME
DESCRIPTION
115
VCC
Power supply pin
2
16
SHDN
Shutdown active low input
3
1
RH0
“High” terminal of DCP0
4
2
RL0
“Low” terminal of DCP0
5
3
RW0
“Wiper” terminal of DCP0
6
5
A2
Device address input for the I2C interface
7
6
SCL
Open drain I2C interface clock input
8
7
SDA
Open drain Serial data I/O for the I2C interface
9
8
GND
Device ground pin
10
RW1
“Wiper” terminal of DCP1
11
RL1
“Low” terminal of DCP1
12
RH1
“High” terminal of DCP1
13
A0
Device address input for the I2C interface
14
A1
Device address input for the I2C interface
4, 9
NC
No connection
EPAD*
Exposed Die Pad internally connected to GND
*Note: PCB thermal land for QFN EPAD should be connected to GND plane or left floating. For more information refer to
http://www.intersil.com/data/tb/TB389.pdf
ISL22326
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