参数资料
型号: ISL22343UFR20Z
厂商: Intersil
文件页数: 9/18页
文件大小: 0K
描述: IC POT DGTL 256TP LN LP 20-QFN
标准包装: 600
系列: XDCP™
接片: 256
电阻(欧姆): 50k
电路数: 4
温度系数: 标准值 ±45 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 2.25 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-VQFN 裸露焊盘
供应商设备封装: 20-QFN 裸露焊盘(5x5)
包装: 管件
17
FN6423.1
March 13, 2008
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L20.5x5
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.80
0.90
1.00
-
A1
-
0.02
0.05
-
A2
-
0.65
1.00
9
A3
0.20 REF
9
b
0.23
0.30
0.38
5, 8
D
5.00 BSC
-
D1
4.75 BSC
9
D2
2.95
3.10
3.25
7, 8
E
5.00 BSC
-
E1
4.75 BSC
9
E2
2.95
3.10
3.25
7, 8
e
0.65 BSC
-
k0.20
-
L
0.35
0.60
0.75
8
N20
2
Nd
5
3
Ne
5
3
P-
-
0.60
9
θ
--
12
9
Rev. 4 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Compliant to JEDEC MO-220VHHC Issue I except for the "b"
dimension.
ISL22343
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