参数资料
| 型号： | ISL22419WFU8Z-TK |
| 厂商： | Intersil |
| 文件页数： | 7/13页 |
| 文件大小： | 0K |
| 描述： | IC POT DGTL 128TP LN LP 8-MSOP |
| 标准包装： | 1,000 |
| 系列： | XDCP™ |
| 接片： | 128 |
| 电阻（欧姆）： | 10k |
| 电路数： | 1 |
| 温度系数： | 标准值 ±50 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | 4 线 SPI（芯片选择） |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
3
FN6311.1
September 8, 2009
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
with Respect to GND . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Voltage at any DCP pin with Respect to GND . . . . . . . -0.3V to VCC
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 2) . . . . . . . . . . . . . . . . . . Class II, Level B @+125°C
ESD Rating
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5kV
CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
8 Lead MSOP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
165
Maximum Junction Temperature (Plastic Package). . . . . . . .+150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
Recommended Operating Conditions
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
VCC Voltage for DCP Operation . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3mA to 3mA
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
ΝΟΤΕΣ:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -1V for all pins.
Analog Specifications
Over recommended operating conditions unless otherwise stated. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(Note 3)
MAX
UNIT
RTOTAL
End-to-End Resistance
W option
10
k
Ω
U option
50
k
Ω
End-to-End Resistance Tolerance
-20
+20
%
End-to-End Temperature Coefficient
W option
±50
ppm/°C
(Note 11)
U option
±80
ppm/°C
(Note 11)
RW
(Note 11)
Wiper Resistance
VCC = 3.3V @ +25°C,
wiper current = VCC/RTOTAL
70
Ω
CW
(Note 11)
Wiper Capacitance
25
pF
ILkgRW
Leakage on RW Pin
Voltage at pin from GND to VCC
24
A
VOLTAGE DIVIDER MODE ( measured at RW, unloaded)
INL
(Note 7)
Integral Non-linearity
-1
1
LSB
(Note 4)
DNL
(Note 6)
Differential Non-linearity
Monotonic over all tap positions
-0.5
0.5
LSB
(Note 4)
ZSerror
(Note 5)
Zero-scale Error
W option
0
1
5
LSB
(Note 4)
U option
0
0.5
2
LSB
(Note 4)
FSerror
(Note 6)
Full-scale Error
W option
-5
-1
0
LSB
(Note 4)
U option
-2
-1
0
LSB
(Note 4)
TCV
(Notes 8, 11)
Ratiometric Temperature Coefficient
DCP register set to 40 hex
±4
ppm/°C
ISL22419
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