参数资料
型号: ISL24021IRT065Z
厂商: Intersil
文件页数: 3/13页
文件大小: 0K
描述: IC OPAMP RRIO 1A 25MHZ 8-TDFN
标准包装: 100
放大器类型: 电压反馈
电路数: 1
输出类型: 满摆幅
转换速率: 19 V/µs
-3db带宽: 27MHz
电流 - 输入偏压: 2nA
电压 - 输入偏移: 1400µV
电流 - 电源: 2.2mA
电流 - 输出 / 通道: 300mA
电压 - 电源,单路/双路(±): 4.5 V ~ 19 V,±2.25 V ~ 9.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-TDFN(3x3)
包装: 管件
ISL24021
11
FN6637.1
October 18, 2011
Printed Circuit Board Layout
As with any high-frequency device, good printed circuit board
layout is necessary for optimum performance. For the ISL24021
low impedance analog power and ground planes are
recommended, and trace lengths should be as short as possible.
The power supply pins must be well bypassed to reduce the risk
of oscillation. For optimal thermal and operating performance
the ISL24021 thermal pad should always be connected to the
lowest potential, VSS.
For normal single supply operation (the VSS pin is connected to
GND) a 4.7F capacitor should be placed from VDD to GND, then
a parallel 0.1F capacitor should be connected as close to the
amplifier as possible. For dual supply operation the same
bypassing techniques should be utilized by connecting capacitors
from each supply to GND.
FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD - TDFN
EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5
0
0.5
1.0
1.5
2.0
2.5
3.0
0
25
50
75
100
125
150
AMBIENT TEMP (°C)
POWE
R
DI
SSI
P
A
TI
ON
(W)
θJA = +50 (°C/W)
2.5W
TDFN8
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