ISL26712, ISL26710, ISL26708
5
FN7999.3
September 5, 2012
Absolute Maximum Ratings
Thermal Information
Any Pin to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Analog Input to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V
Digital I/O to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V
Digital Input Voltage to GND . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V
Maximum Current In to Any Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
ESD Rating
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 8kV
Machine Model (Tested per JESD22-A115B) . . . . . . . . . . . . . . . . . 400V
Charged Device Model (Tested per JESD22-C101E)
TDFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0kV
SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5kV
Latch Up (Tested per JESD78C; Class 2, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
8 Ld TDFN Package (Notes
6, 8) . . . . . . . . .
41
6
8 Ld SOT-23 Package (Notes
7,
9). . . . . . . .
135
99
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
6.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
7.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
9. For
θJC, the “case temp” location is taken at the package top center.
Electrical Specifications VDD = +3.0V to +3.6V, FSCLK = 18MHz, FS = 1MSPS, VREF = 2.0V; VDD = +4.75V to +5.25V, FSCLK = 18MHz,
FS =1MSPS, VREF = 2.5V; VCM = VREF, unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply over the operating temperature
range, -40°C to +85°C.
SYMBOL
PARAMETER
TEST CONDITIONS
ISL26712
ISL26710
ISL26708
UNITS
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
DYNAMIC PERFORMANCE
SINAD Signal-to (Noise +
Distortion) Ratio
FIN = 100kHz
VDD = +4.75V to +5.25V
70.0
71.4
61.0
61.6
49.0
49.8
dB
FIN = 100kHz
VDD = +3.0V to +3.6V
68.5
70.5
60.7
61.5
49.0
49.8
dB
THD
Total Harmonic
Distortion
FIN = 100kHz
VDD = +4.75V to +5.25V
-84
-76
-82
-74
-75
-60
dB
FIN = 100kHz
VDD = +3.0V to +3.6V
-84
-74
-82
-72
-73
-60
dB
SFDR Spurious Free Dynamic
Range
FIN = 100kHz
VDD = +4.75V to +5.25V
-87
-76
-82
-76
-68
-60
dB
FIN = 100kHz
VDD = +3.0V to +3.6V
-85
-74
-82
-74
-68
-60
dB
IMD
Intermodulation
Distortion
2nd and 3rd order,
FIN = 90kHz, 110kHz
-89
-83
-81
dB
tpd
Aperture Delay
1
ns
Δtpd Aperture Jitter
15
ps
β3dB Full Power Bandwidth
@ –3dB
15
MHz
DC ACCURACY
NResolution
12
10
8
Bits
INL
Integral Nonlinearity
-1
±0.4
1-0.5
±0.1
0.5
-0.2
±0.03
0.2
LSB
DNL
Differential Nonlinearity Guaranteed no missing
codes
-0.95
±0.3
0.95
-0.5
±0.1
0.5
-0.2
±0.03
0.2
LSB
OFFSET Zero-Code Error
Zero Volt Differential Input
-6
±0.2
6-2.5
±0.2
2.5
-1.25
±0.03
1.25
LSB