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参数资料
| 型号： | ISL29003IROZ-EVALZ |
| 厂商： | Intersil |
| 文件页数： | 11/14页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD FOR ISL29003 |
| 标准包装： | 1 |
| 传感器类型： | 灯光，数字式输出 |
| 传感范围： | 64000Lux |
| 接口： | I²C |
| 灵敏度： | 550nm |
| 电源电压： | 2.25 V ~ 3.3 V |
| 嵌入式： | 否 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ISL29003 |
ISL29003
TABLE 16. RECOMMENDED DIMENSIONS FOR A FLAT
WINDOW DESIGN
Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence
D LENS @ 35°
D LENS @ 45°
with package pads. Since ambient light sensor devices do
D TOTAL
1.5
2.0
2.5
3.0
3.5
D1
0.50
1.00
1.50
2.00
2.50
VIEWING ANGLE
2.25
3.00
3.75
4.30
5.00
VIEWING ANGLE
3.75
4.75
5.75
6.75
7.75
not dissipate high power, heat dissipation through the
exposed pad is not important; instead, similar to DFN or
QFN, the exposed pad provides robustness in board mount
process. Intersil recommends mounting the exposed pad to
the PCB, but this is not mandatory.
Layout Considerations
The ISL29003 is relatively insensitive to layout. Like other
t=1
D1
D LENS
D TOTAL
Thickness of lens
Distance between ISL29001 and inner edge of lens
Diameter of lens
Distance constraint between the ISL29001 and lens
outer edge
I 2 C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I 2 C traces as far as possible from all
*All dimensions are in mm.
2.10mm
sources of noise. Use two power-supply decoupling
capacitors, 4.7μF and 0.1μF, placed close to the device.
Typical Circuit
1
6
A typical application for the ISL29003 is shown in Figure 6.
The ISL29003’s I 2 C address is internally hardwired as
1000100. The device can be tied onto a system’s I 2 C bus
2.00mm
2
0.29mm
5
0.56mm
together with other I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
3
0.46mm
4
direct-infrared heating is not recommended. The plastic
ODFN package does not require a custom reflow soldering
profile, and is qualified to +260°C. A standard reflow
soldering profile with a +260°C maximum is recommended.
FIGURE 5. SENSOR LOCATION DRAWING
1.8V TO 5.5V
R1
10k
R2
10k
R3
RES1
I 2 C MASTER
MICROCONTROLLER
SDA
SCL
2.5V TO 3.3V
I 2 C SLAVE_0
I 2 C SLAVE_1
I 2 C SLAVE_n
C1 C2
4.7μF 0.1μF
1
2
3
VDD
GND
REXT
SDA
SCL
INT
6
5
4
SDA
SCL
SDA
SCL
REXT
100k
ISL29003
FIGURE 6. ISL29003 TYPICAL CIRCUIT
11
FN7464.6
November 17, 2011
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