参数资料
| 型号： | ISL32173EFVZ |
| 厂商： | Intersil |
| 文件页数： | 15/22页 |
| 文件大小： | 0K |
| 描述： | IC RCVR RS485/422 QD ESD 16TSSOP |
| 产品培训模块： | Solutions for Industrial Control Applications |
| 标准包装： | 960 |
| 类型： | 接收器 |
| 驱动器/接收器数： | 0/4 |
| 规程： | RS422，RS485 |
| 电源电压： | 3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
22
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7529.1
March 14, 2013
For additional products, see www.intersil.com/product_tree
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
14 LD 16 LD 20 LD 24 LD 28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
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| ISL32173EFVZ-T | 功能描述:IC RCVR RS485/422 QD ESD 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32173EIBZ | 功能描述:IC RCVR RS485/422 QD ESD 16SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32173EIBZ-T | 功能描述:IC RCVR RS485/422 QD ESD 16SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32173EIVZ | 功能描述:IC RCVR RS485/422 QD ESD 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32173EIVZ-T | 功能描述:IC RCVR RS485/422 QD ESD 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
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