参数资料
| 型号： | ISL32174EIVZ-T |
| 厂商： | Intersil |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC XMITTER ESD RS422 LP 16-TSSOP |
| 标准包装： | 2,500 |
| 类型： | 发射器 |
| 驱动器/接收器数： | 4/0 |
| 规程： | RS422 |
| 电源电压： | 3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 带卷 (TR) |
3
FN6824.1
March 13, 2013
ISL32274EFVZ
32274 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32274EIBZ
ISL32274 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32274EIVZ
32274 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32372EFBZ
ISL32372 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32372EFVZ
32372 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32372EIBZ
ISL32372 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32372EIVZ
32372 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32374EFBZ
ISL32374 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32374EFVZ
32374 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32374EIBZ
ISL32374 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32374EIVZ
32374 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E,
Ordering Information (Continued)
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
Truth Tables
ISL32172E, ISL32272E, ISL32372E
INPUTS
OUTPUTS
EN
DIX
ZX
YX
X
0
1/0
0/1
1/0
1
X
0/1
1/0
0/1
01
X
Z
NOTE: Z = Tri-state
ISL32174E, ISL32274E, ISL32374E
INPUTS
OUTPUTS
EN12
EN34 DIX
Z1Y1
Z2Y2
Z3Y3
Z4Y4
0
X
Z
ZZZZZZZ
0
1
1/0
Z
0/1
1/0
0/1
1/0
1
0
1/0
0/1
1/0
0/1
1/0
Z
1
1/0
0/1
1/0
0/1
1/0
0/1
1/0
0/1
1/0
NOTE: Z = Tri-state
ISL32179E
INPUTS
OUTPUTS
ENX EN EN DIX SPA SPB ZX YX
COMMENTS
0
X
Z
Chan X outputs disabled
X
0
1
X
Z
All outputs disabled
1
X
0
1/0
1
0/1 1/0 Individual ENX controls
chan X (32Mbps)
1
X
0/1
1
1/0 0/1
1
X
0
1/0
0
1
0/1 1/0 Individual ENX controls
chan X (10Mbps)
1
X
0/1
0
1
1/0 0/1
1
X
0
1/0
X*
0
0/1 1/0 Individual ENX controls
chan X (460kbps)
1
X
0/1
X*
0
1/0 0/1
NOTE: *Keep SPA = 1 for lowest current in SHDN. If using individual
channel enables, and the SHDN mode, connect EN and EN to VCC
for the lowest SHDN current. ISL32179E enters SHDN when
SHDNEN = 1 and all channels are disabled. Z = Tri-state.
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL32175E | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:QUAD, ±16.5kV ESD Protected, 3.0V to 5.5V, RS-485/RS-422 Receivers |
| ISL32175EFBZ | 功能描述:IC RCVR RS485/422 QD ESD 16SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32175EFBZ-T | 功能描述:IC RCVR RS485/422 QD ESD 16SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32175EFVZ | 功能描述:IC RCVR RS485/422 QD ESD 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ISL32175EFVZ-T | 功能描述:IC RCVR RS485/422 QD ESD 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:发射器 驱动器/接收器数:4/0 规程:RS422，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
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