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参数资料
| 型号： | ISL33003IUZ |
| 厂商： | Intersil |
| 文件页数： | 13/18页 |
| 文件大小： | 0K |
| 描述： | IC BUS BUFF HOTSWAP 2WR 8MSOP |
| 标准包装： | 50 |
| 类型： | 缓冲器 |
| Tx/Rx类型： | I²C Logic |
| 电容 - 输入： | 10pF |
| 电源电压： | 2.3 V ~ 5.5 V |
| 电流 - 电源： | 4mA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 管件 |
| 配用： | ISL33003MSOPEVAL1Z-ND - EVAL BOARD ISL33003 8MSOP |
ISL33001, ISL33002, ISL33003
4
FN7560.5
December 19, 2013
Absolute Maximum Ratings
(All voltages referenced to GND)
Thermal Information
VCC1, VCC2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V
SDA_IN, SCL_IN, SDA_OUT, SCL_OUT, READY. . . . . . . . . . . . . . -0.3V to +7V
ENABLE, ACC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +(VCC1 + 0.3)V
Maximum Sink Current (SDA and SCL Pins) . . . . . . . . . . . . . . . . . . . . 20mA
Maximum Sink Current (READY pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . 7mA
Latch-Up Tested per JESD78, Level 2, Class A . . . . . . . . . . . . . . . . . . . 85°C
ESD Ratings. . . . . . . . . . . . . . . . . . . . . . . See “ESD PROTECTION” on page 5
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
VCC1 and VCC2 Supply Voltage Range . . . . . . . . . . . . . . . . . .+2.3V to +5.5V
Thermal Resistance
θ
JA (°C/W)
θ
JC (°C/W)
8 Ld TDFN Package (Notes 5, 6). . . . . . . . . .
47
4
(0.50mm Pitch)
8 Ld TDFN Package (Notes 5, 6). . . . . . . . . .
48
6
(0.65mm Pitch)
8 Ld MSOP Package (Notes 4, 7) . . . . . . . . .
151
50
8 Ld SOIC Package (Notes 4, 7) . . . . . . . . . .
120
56
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
6. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
7. For
θJC, the “case temp” location is taken at the package top center.
Electrical Specifications VEN = VCC1, VCC1 = +2.3V to +5.5V, VCC2 = +2.3V to +5.5V, unless otherwise noted (Note 8). Boldface limits apply
over the operating temperature range, -40°C to +85°C.
PARAMETER
SYMBOL
CONDITIONS
TEMP
(°C)
MIN
(Note 9)
TYP
MAX
(Note 9)
UNITS
POWER SUPPLIES
VCC1 Supply Range
VCC1
Full
2.3
-
5.5
V
VCC2 Supply Range
VCC2
ISL33002 and ISL33003
Full
2.3
-
5.5
V
Supply Current from VCC1
ICC1
Full
-
2.1
4.0
mA
VCC1 = VCC2 = 5.5V; ISL33002 and ISL33003
(Note 11)
Full
-
2.0
3.0
mA
Supply Current from VCC2
ICC2
VCC2 = VCC = 5.5V; ISL33002 and ISL33003
(Note 11)
Full
-
0.22
0.6
mA
VCC1 Shut-down Supply
Current
ISHDN1
VCC1 = 5.5V, VEN = GND; ISL33001 only
Full
-
0.5
-
A
VCC1 = VCC2 = 5.5V, VEN = GND; ISL33003 only
(Note 13)
Full
-
0.05
-
A
VCC2 Shut-down Supply
Current
ISHDN2
VCC1 = VCC2 = 5.5V, VEN = GND, ISL33003 only
(Note 13)
Full
-
0.06
-
A
START-UP CIRCUITRY
Precharge Circuitry
Voltage
VPRE
SDA and SCL pins floating
Full
0.8
1
1.2
V
Enable High Threshold
Voltage
VEN_H
+25
-
0.5*VCC
0.7*VCC
V
Enable Low Threshold
Voltage
VEN_L
+25
0.3*VCC
0.5*VCC
-V
Enable Pin Input Current
IEN
Enable from 0V to VCC1; ISL33001 and
ISL33003
Full
-1
0.1
1
A
Enable Delay, On-Off
tEN-HL
ISL33001 and ISL33003 (Note 10)
+25
-
10
-
ns
Enable Delay, Off-On
tEN-LH
ISL33001 and ISL33003 (Figure 3)
+25
-
86
-
s
Bus Idle Time
tIDLE
Full
50
83
150
s
Ready Pin OFF State
Leakage Current
IOFF
ISL33001 only
+25
-1
0.1
1
A
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