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参数资料
| 型号： | ISL5239KIZ |
| 厂商： | INTERSIL CORP |
| 元件分类： | 消费家电 |
| 英文描述： | Pre-Distortion Linearizer |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PBGA196 |
| 封装： | 15 X 15 MM, ROHS COMPLIANT, PLASTIC, BGA-196 |
| 文件页数： | 15/31页 |
| 文件大小： | 653K |
| 代理商： | ISL5239KIZ |
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15
Absolute Maximum Ratings
Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . +2.5VCCC, 4.6V VCCIO
Input, Output or I/O Voltage. . . . . . . . . . . . . . . . .GND -0.5V to 5.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 2
Operating Conditions
Voltage Range Core, V
CCC
. . . . . . . . . . . . . . . . . .+1.71V to +1.89V
Voltage Range I/O, V
CCCIO (Note 3)
. . . . . . . . .+3.135V to +3.465V
Temperature Range
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V
CC
Thermal Resistance (Typical, Notes 1, 2)
196 BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 125
o
C
θ
JA
(
o
C/W)
42
38
36
For Recommended Soldering Conditions, See Tech Brief TB334.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board. See Tech Brief TB379.
2. With “direct attach” features (i.e., vias in the PCB), the thermal resistance is 36 without airflow, w/200 it is 33, w/400 it is 31
o
C/W. Tie 196 BGA
package pins F6-9, G6-9, H6-9, J6-9 to heat sink or ground with vias to ensure maximum device heat dissipation.
3. Single supply operation of both the core VCCC and I/O VCCIO at 1.8V is not allowed.
DC Electrical Specifications
V
CCC
= 1.8± 5%, V
CCIO
= 3.3
±
5%, T
A
= -40
o
C to 85
o
C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Typ
MAX
UNITS
Logical One Input Voltage
V
IH
V
CCC
= 1.89V, V
CCIO
= 3.465V
2.0
-
V
Logical Zero Input Voltage
V
IL
V
CCC
= 1.71V, V
CCIO
= 3.135V
-
0.8
V
Clock Input High
V
IHC
V
CCC
= 1.89V, V
CCIO
= 3.465V
2.0
-
V
Clock Input Low
V
ILC
V
CCC
= 1.71V, V
CCIO
= 3.135V
-
0.8
V
Output High Voltage
V
OH
I
OH
= -2mA, V
CCC
= 1.71V, V
CCIO
= 3.135V
2.6
V
CC
-0.2
-
V
Output Low Voltage
V
OL
I
OL
= 2mA, V
CCC
= 1.71V, V
CCIO
= 3.135V
0.2
0.4
V
Input Leakage Current
I
L
V
IN
= V
CCIO
or GND, V
CCC
= 1.89V,
V
CCIO
= 3.465V
-10
1
10
μ
A
Output Leakage Current
I
H
V
IN
= V
CCIO
or GND, V
CCC
= 1.89V,
V
CCIO
= 3.465V
-10
1
10
μ
A
Input Pull-up Leakage Current Low
I
SL
V
IN
= V
CCIO
or GND, V
CCC
= 1.89V,
V
CCIO
= 3.465V, TMS, TRST, TDI
-100
-50
-
μ
A
Input Pull-up Leakage Current High
I
SH
V
IN
= V
CCIO
or GND, V
CCC
= 1.89V,
V
CCIO
= 3.465V, TMS, TRST, TDI
-
1
10
μ
A
Standby Power Supply Current
I
CCSB
V
CCC
= 1.89V, V
CCIO
= 3.465V, Outputs Not
Loaded
-
1
100
3
500
mA(core)
uA(I/O)
Operating Power Supply Current
I
CCOP
f = 125MHz, V
IN
= V
CCIO
or GND,
V
CCIO
= 3.465V, V
CCC
= 1.89V,
-
300
100
mA (Core)
mA(I/O),
(Note
4)
Input Capacitance
C
IN
Freq = 1MHz, V
CCIO
Open, All Measurements
Are Referenced to Device Ground
-
5
pF (Note 5)
Output Capacitance
C
OUT
Freq = 1MHz, V
CCIO
Open, All Measurements
are Referenced to Device Ground
-
5
pF (Note 5)
NOTES:
4. Power Supply current is proportional to operation frequency. Typical rating for I
CCOP
is 2.0 mA/MHz (core) and 0.5mA/MHz(I/O),
5. Capacitance T
A
= 25
o
C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
process or design changes.
ISL5239
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